Datasheet HMC902 (Analog Devices) - 5
| Fabricante | Analog Devices |
| Descripción | 5 GHz to 11 GHz GaAs, pHEMT, MMIC, Low Noise Amplifier |
| Páginas / Página | 13 / 5 — Data Sheet. HMC902. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. VDD1. … |
| Revisión | D |
| Formato / tamaño de archivo | PDF / 274 Kb |
| Idioma del documento | Inglés |
Data Sheet. HMC902. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. VDD1. VDD2. RFIN. RFOUT. VGG1. VGG2. NOTES
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Data Sheet HMC902 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 2 3 VDD1 VDD2 1 RFIN HMC902 RFOUT 4 VGG1 VGG2 6 5
002
NOTES 1. DIE BOTTOM MUST BE CONNECTED TO RF/DC GROUND.
14525- Figure 2. Pad Configuration
Table 3. Pad Function Descriptions Pad No. Mnemonic Description
1 RFIN Radio Frequency Input. This pin is matched to 50 Ω. See Figure 3 for the interface schematic. 2, 3 VDD1, VDD2 Power Supply Voltages. Power supply voltage for the amplifier; see Figure 24 and Figure 25 for required external components. See Figure 4 for the interface schematic. 4 RFOUT Radio Frequency Output. This pad is matched to 50 Ω. See Figure 5 for the interface schematic. 5, 6 VGG2, VGG1 Gate Control Voltages. Optional gate control for the amplifier. When left open, the amplifier is self biased. Applying a negative voltage reduces the current. See Figure 6 for the interface schematic. Die Bottom GND Ground. Die bottom must be connected to RF/dc ground. See Figure 7 for the interface schematic.
INTERFACE SCHEMATICS RFIN ESD
003 14525- 006
VGG1, VGG2
14525- Figure 3. RFIN Interface Schematic Figure 6. VGG1, VGG2 Interface Schematic
VDD1, VDD2 GND
007 14525- 004 14525- Figure 4. VDD1, VDD2 Interface Schematic Figure 7. GND Interface Schematic
RFOUT ESD
005 14525- Figure 5. RFOUT Interface Schematic Rev. D | Page 5 of 13 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUITS ASSEMBLY DIAGRAMS OUTLINE DIMENSIONS ORDERING GUIDE
Data Sheet HMC902 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 2 3 VDD1 VDD2 1 RFIN HMC902 RFOUT 4 VGG1 VGG2 6 5
002
NOTES 1. DIE BOTTOM MUST BE CONNECTED TO RF/DC GROUND.
14525- Figure 2. Pad Configuration
Table 3. Pad Function Descriptions Pad No. Mnemonic Description
1 RFIN Radio Frequency Input. This pin is matched to 50 Ω. See Figure 3 for the interface schematic. 2, 3 VDD1, VDD2 Power Supply Voltages. Power supply voltage for the amplifier; see Figure 24 and Figure 25 for required external components. See Figure 4 for the interface schematic. 4 RFOUT Radio Frequency Output. This pad is matched to 50 Ω. See Figure 5 for the interface schematic. 5, 6 VGG2, VGG1 Gate Control Voltages. Optional gate control for the amplifier. When left open, the amplifier is self biased. Applying a negative voltage reduces the current. See Figure 6 for the interface schematic. Die Bottom GND Ground. Die bottom must be connected to RF/dc ground. See Figure 7 for the interface schematic.
INTERFACE SCHEMATICS RFIN ESD
003 14525- 006
VGG1, VGG2
14525- Figure 3. RFIN Interface Schematic Figure 6. VGG1, VGG2 Interface Schematic
VDD1, VDD2 GND
007 14525- 004 14525- Figure 4. VDD1, VDD2 Interface Schematic Figure 7. GND Interface Schematic
RFOUT ESD
005 14525- Figure 5. RFOUT Interface Schematic Rev. D | Page 5 of 13 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUITS ASSEMBLY DIAGRAMS OUTLINE DIMENSIONS ORDERING GUIDE