Datasheet ADL9006 (Analog Devices) - 5
| Fabricante | Analog Devices |
| Descripción | 2 GHz to 28 GHz, GaAs, pHEMT, MMIC Low Noise Amplifier |
| Páginas / Página | 14 / 5 — Data Sheet. ADL9006. ABSOLUTE MAXIMUM RATINGS Table 5. ELECTROSTATIC … |
| Formato / tamaño de archivo | PDF / 400 Kb |
| Idioma del documento | Inglés |
Data Sheet. ADL9006. ABSOLUTE MAXIMUM RATINGS Table 5. ELECTROSTATIC DISCHARGE (ESD) RATINGS. Parameter. Rating
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Data Sheet ADL9006 ABSOLUTE MAXIMUM RATINGS Table 5. ELECTROSTATIC DISCHARGE (ESD) RATINGS Parameter Rating
The following ESD information is provided for handling of ESD VDD 8 V sensitive devices in an ESD protected area only. VGG2 −2.6 V to +3.6 V Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. RF Input Power (RFIN) 20 dBm Continuous Power Dissipation (P
ESD Ratings for ADL9006
DISS), 1.96 W TA = 85°C (Derate 21.7 mW/°C Above 85°C) Maximum Peak Reflow Temperature, 260°C
Table 7. ADL9006, 32-Lead LFCSP_CAV
Moisture Sensitivity Level 3 (MSL3)
ESD Model Withstand Threshold (V) Class
Channel Temperature to Maintain 1,000,000 175°C HBM 500 1B Hour Meant Time to Failure (MTTF) Nominal Channel Temperature (T = 85°C, 98°C
ESD CAUTION
VDD = 5 V) Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +85°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θ JC is the junction to case thermal resistance.
Table 6. Thermal Resistance Package θJC Unit
CG-32-21 46 °C/W 1 Thermal resistance (θ JC) was determined by simulation under the following conditions: the heat transfer is due solely to thermal conduction from the channel, through the ground paddle, to the PCB, and the ground paddle is held constant at the operating temperature of 85°C. Rev. 0 | Page 5 of 14 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications 2 GHz to 6 GHz 6 GHz to 20 GHz 20 GHz to 28 GHz DC Specifications Absolute Maximum Ratings Electrostatic Discharge (ESD) Ratings ESD Ratings for ADL9006 ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Outline Dimensions Ordering Guide
The following ESD information is provided for handling of ESD VDD 8 V sensitive devices in an ESD protected area only. VGG2 −2.6 V to +3.6 V Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. RF Input Power (RFIN) 20 dBm Continuous Power Dissipation (P
ESD Ratings for ADL9006
DISS), 1.96 W TA = 85°C (Derate 21.7 mW/°C Above 85°C) Maximum Peak Reflow Temperature, 260°C
Table 7. ADL9006, 32-Lead LFCSP_CAV
Moisture Sensitivity Level 3 (MSL3)
ESD Model Withstand Threshold (V) Class
Channel Temperature to Maintain 1,000,000 175°C HBM 500 1B Hour Meant Time to Failure (MTTF) Nominal Channel Temperature (T = 85°C, 98°C
ESD CAUTION
VDD = 5 V) Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +85°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θ JC is the junction to case thermal resistance.
Table 6. Thermal Resistance Package θJC Unit
CG-32-21 46 °C/W 1 Thermal resistance (θ JC) was determined by simulation under the following conditions: the heat transfer is due solely to thermal conduction from the channel, through the ground paddle, to the PCB, and the ground paddle is held constant at the operating temperature of 85°C. Rev. 0 | Page 5 of 14 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications 2 GHz to 6 GHz 6 GHz to 20 GHz 20 GHz to 28 GHz DC Specifications Absolute Maximum Ratings Electrostatic Discharge (ESD) Ratings ESD Ratings for ADL9006 ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Outline Dimensions Ordering Guide