link to page 17 link to page 17 link to page 6 link to page 6 link to page 6 link to page 6 link to page 6 HMC8412Data SheetPIN CONFIGURATION AND FUNCTION DESCRIPTIONSHMC8412TOP VIEW(Not to Scale)R16BIASVDDGND 25 GNDRF34INRFOUTNOTES 1. EXPOSED PAD. THE EXPOSED PAD 002 MUST BE CONNECTED TO THE RF AND DC GROUND. 23882- Figure 2. Pin Configuration Table 7. Pin Function Descriptions Pin No.MnemonicDescription 1 RBIAS Current Mirror Bias Resistor. Use the RBIAS pin to set the quiescent current by connecting the external bias resistor as defined in Table 8. Refer to Figure 60 for the bias resistor connection. See Figure 3 for the interface schematic. 2, 5 GND Ground. The GND pin must be connected to RF and dc ground. See Figure 6 for the interface schematic. 3 RFIN RF Input. The RFIN pin is ac-coupled and matched to 50 Ω. See Figure 4 for the interface schematic. 4 RFOUT RF Output. The RFOUT pin is ac-coupled and matched to 50 Ω. See Figure 5 for the interface schematic. 6 VDD Drain Supply Voltage for the Amplifier. See Figure 5 for the interface schematic. EPAD Exposed Pad. The exposed pad must be connected to the RF and dc ground. INTERFACE SCHEMATICSRBIASVDDRFOUT 003 005 23882- 23882- Figure 3. RBIAS Interface Schematic Figure 5. VDD and RFOUT Interface Schematic 004 GND 006 RFIN 23882- 23882- Figure 4. RFIN Interface Schematic Figure 6. GND Interface Schematic Rev. 0 | Page 6 of 18 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications 0.4 GHz to 3 GHz Frequency Range 3 GHz to 9 GHz Frequency Range 9 GHz to 11 GHz Frequency Range Absolute Maximum Ratings Thermal Resistance Electrostatic Discharge (ESD) Ratings ESD Ratings for HMC8412 ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Recommended Bias Sequencing Power-Up Sequence Power-Down Sequence Outline Dimensions Ordering Guide