Datasheet MC1488 (ON Semiconductor) - 9

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS PDIP−14
CASE 646−06 ISSUE S DATE 22 APR 2015 1
SCALE 1:1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
D A
2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
14 8 E
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
H
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT TO EXCEED 0.10 INCH.
E1
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR TO DATUM C. 6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
1 7
LEADS UNCONSTRAINED.
c NOTE 8 b2 B
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
TOP VIEW END VIEW
LEADS, WHERE THE LEADS EXIT THE BODY.
WITH LEADS CONSTRAINED
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
NOTE 5
CORNERS).
A2 A INCHES MILLIMETERS DIM MIN MAX MIN MAX NOTE 3 A
−−−− 0.210 −−− 5.33
L A1
0.015 −−−− 0.38 −−−
A2
0.115 0.195 2.92 4.95
SEATING b
0.014 0.022 0.35 0.56
A1 PLANE b2
0.060 TYP 1.52 TYP
C C
0.008 0.014 0.20 0.36
M D
0.735 0.775 18.67 19.69
D1 D1
0.005 −−−− 0.13 −−−
e eB E
0.300 0.325 7.62 8.26
14X b END VIEW E1
0.240 0.280 6.10 7.11
e
0.100 BSC 2.54 BSC
NOTE 6
0.010 C A
SIDE VIEW
M M B M
eB
−−−− 0.430 −−− 10.92
L
0.115 0.150 2.92 3.81
M
−−−− 10 ° −−− 10 °
GENERIC MARKING DIAGRAM*
14 XXXXXXXXXXXX XXXXXXXXXXXX AWLYYWWG
STYLES ON PAGE 2
1 XXXXX = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present.
DOCUMENT NUMBER: 98ASB42428B
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DESCRIPTION: PDIP−14 PAGE 1 OF 2
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