Datasheet EPC2059 (Efficient Power Conversion) - 6

eGaN® FET DATASHEET
EPC2059
RECOMMENDED
Land pattern is solder mask defined.
LAND PATTERN
A Solder mask is same as bump. (units in µm) It is recommended to have on-Cu trace PCB vias,
1
g Pad 1 is Gate;
DIM Nominal
Pads 2 ,4, 6
A
2800 are Source; h
B
1400
3 4
d c B
5 6
Pads 3, 5 are Drain
c
1010
d
1250 g
2 e
600
f
250
g
475 f e
h
775
RECOMMENDED STENCIL DRAWING
(units in µm) A
DIM Nominal A
2800
B
1400
1
g
c
1010
d
1250 h
3 4
d c B
e
600
5 6 f
250
g
475 g
2 h
775 f e Recommended stencil should be 4 mil (100 µm) thick, must be laser cut, openings per drawing. The corner has a radius of R60. Intended for use with SAC305 Type 3 solder, reference 88.5% metals content. Split stencil design can be provided upon request, but EPC has tested this stencil design and not found any scooping issues. Additional assembly resources available at https://epc-co.com/epc/DesignSupport/AssemblyBasics.aspx Efficient Power Conversion Corporation (EPC) reserves the right to make changes without further notice to any products herein to improve reliability, function or design. EPC does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. Information subject to eGaN® is a registered trademark of Efficient Power Conversion Corporation. change without notice. EPC Patent Listing: epc-co.com/epc/AboutEPC/Patents.aspx Revised October, 2020 EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2020 | | 6