Datasheet EPC2059 (Efficient Power Conversion) - 5

eGaN® FET DATASHEET
EPC2059
TAPE AND REEL CONFIGURATION e f
4 mm pitch, 8 mm wide tape on 7” reel Loaded Tape Feed Direction
d g
7” inch reel Die orientation
b
dot
Z Z ZZ c Y YYY
Gate solder bar
a
is under this
2059
corner Die is placed into pocket
h
solder bump side down
DIM Dimension (mm)
(face side down)
EPC2059 (Note 1) Target MIN MAX a
8.00 7.90 8.30
b
1.75 1.65 1.85
c
(Note 2) 3.50 3.45 3.55
d
4.00 3.90 4.10
e
4.00 3.90 4.10 Note 1: MSL 1 (moisture sensitivity level 1) classified according to IPC/
f
(Note 2) 2.00 1.95 2.05 JEDEC industry standard.
g
1.50 1.50 1.60 Note 2: Pocket position is relative to the sprocket hole measured as
h
1.00 0.95 1.05 true position of the pocket, not the pocket hole.
DIE MARKINGS 2059 YYYY Laser Markings
Die orientation dot
Part ZZZZ Number Part # Lot_Date Code Lot_Date Code Marking Line 1 Marking Line 2 Marking Line 3
Gate Pad bump is EPC2059 2059 YYYY ZZZZ under this corner
DIE OUTLINE
Solder Bump View A
Micrometers DIM MIN Nominal MAX 2
g
A
2770 2800 2830
B
1370 1400 1430
c
1010 h
3 4
d c B
5 6 d
1250
e
600 g
1 f
250
g
475 f e
h
775 Side View ± -25 518 638
Pad 1 is Gate; Pads 2 ,4, 6 are Source; Pads 3, 5 are Drain
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