Datasheet MAX4400, MAX4401, MAX4402, MAX4403 (Maxim) - 3
| Fabricante | Maxim |
| Descripción | Single/Dual/Quad, Low-Cost, Single-Supply, Rail-to-Rail Op Amps with Shutdown |
| Páginas / Página | 13 / 3 — Package Information (continued). 8 SOT23. PACKAGE CODE. K8+5, K8+5A. … |
| Formato / tamaño de archivo | PDF / 2.4 Mb |
| Idioma del documento | Inglés |
Package Information (continued). 8 SOT23. PACKAGE CODE. K8+5, K8+5A. 21-0078. 90-0176. Thermal Resistance, Single-Layer Board:
Línea de modelo para esta hoja de datos
- MAX4400AUK MAX4400AUK+ MAX4400AUK+C5K MAX4400AUK+T MAX4400AUK-T MAX4400AXK MAX4400AXK+ MAX4400AXK+T MAX4400AXK+T10 MAX4400AXK+TG05 MAX4400AXK+TG24 MAX4400AXK-T
- MAX4401AXT MAX4401AXT+ MAX4401AXT+T MAX4401AXT+TG05 MAX4401AXT+TG126 MAX4401AXT+TG24 MAX4401AXT+TG50 MAX4401AXT-T MAX4401AXT-TG070
Versión de texto del documento
MAX4400–MAX4403 Single/Dual/Quad, Low-Cost, Single-Supply, Rail-to-Rail Op Amps with Shutdown
Package Information (continued) 8 SOT23 PACKAGE CODE K8+5, K8+5A
Outline Number
21-0078
Land Pattern Number
90-0176 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) N/A Junction to Case (θJC) 800°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 196°C/W Junction to Case (θJC) 70°C/W
8 µMAX PACKAGE CODE U8+1
Outline Number
21-00 36
Land Pattern Number
90-0 092 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 221°C/W Junction to Case (θJC) 42°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 206.30°C/W Junction to Case (θJC) 42°C/W
8 SO PACKAGE CODE S8+2
Outline Number
21-00 41
Land Pattern Number
90-0 096 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 170°C/W Junction to Case (θJC) 40°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 136°C/W Junction to Case (θJC) 38°C/W
14 TSSOP PACKAGE CODE U14+1
Outline Number
21-00 66
Land Pattern Number
90-0113 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 110°C/W Junction to Case (θJC) 30°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 100.40°C/W Junction to Case (θJC) 30°C/W www.maximintegrated.com Maxim Integrated │ 3
Package Information (continued) 8 SOT23 PACKAGE CODE K8+5, K8+5A
Outline Number
21-0078
Land Pattern Number
90-0176 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) N/A Junction to Case (θJC) 800°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 196°C/W Junction to Case (θJC) 70°C/W
8 µMAX PACKAGE CODE U8+1
Outline Number
21-00 36
Land Pattern Number
90-0 092 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 221°C/W Junction to Case (θJC) 42°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 206.30°C/W Junction to Case (θJC) 42°C/W
8 SO PACKAGE CODE S8+2
Outline Number
21-00 41
Land Pattern Number
90-0 096 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 170°C/W Junction to Case (θJC) 40°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 136°C/W Junction to Case (θJC) 38°C/W
14 TSSOP PACKAGE CODE U14+1
Outline Number
21-00 66
Land Pattern Number
90-0113 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 110°C/W Junction to Case (θJC) 30°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 100.40°C/W Junction to Case (θJC) 30°C/W www.maximintegrated.com Maxim Integrated │ 3