Datasheet MAX4400, MAX4401, MAX4402, MAX4403 (Maxim) - 2
| Fabricante | Maxim |
| Descripción | Single/Dual/Quad, Low-Cost, Single-Supply, Rail-to-Rail Op Amps with Shutdown |
| Páginas / Página | 13 / 2 — Absolute Maximum Ratings. Package Information. 5 SC70. PACKAGE CODE. … |
| Formato / tamaño de archivo | PDF / 2.4 Mb |
| Idioma del documento | Inglés |
Absolute Maximum Ratings. Package Information. 5 SC70. PACKAGE CODE. X5+1. 21-007. 90-01. Thermal Resistance, Single-Layer Board:
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Versión de texto del documento
MAX4400–MAX4403 Single/Dual/Quad, Low-Cost, Single-Supply, Rail-to-Rail Op Amps with Shutdown
Absolute Maximum Ratings
Power-Supply Voltage (VDD to VSS) ...-0.3V to +6V 8-Pin µMAX (derate 4.5mW/°C above +70°C) ... 362mW All Other Pins .. (VSS - 0.3V) to (VDD + 0.3V) 8-Pin SO (derate 5.88mW/°C above +70°C) .. 471mW Output Short-Circuit Duration 14-Pin TSSOP (derate 8.33mW/°C above +70°C) 727.30mW OUT Shorted to VSS or VDD .. Continuous 14-Pin SO (derate 9.10mW/°C above +70°C) .. 667mW Continuous Power Dissipation (TA = +70°C) Operating Temperature Range ... -40°C to +125°C 5-Pin SC70 (derate 3.10mW/°C above +70°C) ... 246.90mW Storage Temperature Range .. -65°C to +150°C 5-Pin SOT23 (derate 3.90mW/°C above +70°C) ...312.60mW Lead Temperature (soldering, 10s) ...+300°C 6-Pin SC70 (derate 3.10mW/°C above +70°C) ...245mW Soldering Temperature (reflow) ...+260°C 8-Pin SOT23 (derate 5.10mW/°C above +70°C) ...408.2mW Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information 5 SC70 PACKAGE CODE X5+1
Outline Number
21-007 6
Land Pattern Number
90-01 88 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 324°C/W Junction to Case (θJC) 115°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 324°C/W Junction to Case (θJC) 115°C/W
5 SOT23 PACKAGE CODE U5+1
Outline Number
21-0057
Land Pattern Number
90-0174 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 324.30°C/W Junction to Case (θJC) 82°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 255.90°C/W Junction to Case (θJC) 81°C/W
6 SC70 PACKAGE CODE X6SN+1
Outline Number
21-007 7
Land Pattern Number
90-01 89 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 326°C/W Junction to Case (θJC) 115°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 326.50°C/W Junction to Case (θJC) 115°C/W www.maximintegrated.com Maxim Integrated │ 2
Absolute Maximum Ratings
Power-Supply Voltage (VDD to VSS) ...-0.3V to +6V 8-Pin µMAX (derate 4.5mW/°C above +70°C) ... 362mW All Other Pins .. (VSS - 0.3V) to (VDD + 0.3V) 8-Pin SO (derate 5.88mW/°C above +70°C) .. 471mW Output Short-Circuit Duration 14-Pin TSSOP (derate 8.33mW/°C above +70°C) 727.30mW OUT Shorted to VSS or VDD .. Continuous 14-Pin SO (derate 9.10mW/°C above +70°C) .. 667mW Continuous Power Dissipation (TA = +70°C) Operating Temperature Range ... -40°C to +125°C 5-Pin SC70 (derate 3.10mW/°C above +70°C) ... 246.90mW Storage Temperature Range .. -65°C to +150°C 5-Pin SOT23 (derate 3.90mW/°C above +70°C) ...312.60mW Lead Temperature (soldering, 10s) ...+300°C 6-Pin SC70 (derate 3.10mW/°C above +70°C) ...245mW Soldering Temperature (reflow) ...+260°C 8-Pin SOT23 (derate 5.10mW/°C above +70°C) ...408.2mW Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information 5 SC70 PACKAGE CODE X5+1
Outline Number
21-007 6
Land Pattern Number
90-01 88 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 324°C/W Junction to Case (θJC) 115°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 324°C/W Junction to Case (θJC) 115°C/W
5 SOT23 PACKAGE CODE U5+1
Outline Number
21-0057
Land Pattern Number
90-0174 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 324.30°C/W Junction to Case (θJC) 82°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 255.90°C/W Junction to Case (θJC) 81°C/W
6 SC70 PACKAGE CODE X6SN+1
Outline Number
21-007 7
Land Pattern Number
90-01 89 Thermal Resistance, Single-Layer Board:
Junction to Ambient (θJA) 326°C/W Junction to Case (θJC) 115°C/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 326.50°C/W Junction to Case (θJC) 115°C/W www.maximintegrated.com Maxim Integrated │ 2