Datasheet ADL5920 (Analog Devices) - 8
| Fabricante | Analog Devices |
| Descripción | 9 kHz to 7 GHz, Bidirectional RMS and VSWR Detector |
| Páginas / Página | 26 / 8 — ADL5920. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table … |
| Revisión | B |
| Formato / tamaño de archivo | PDF / 808 Kb |
| Idioma del documento | Inglés |
ADL5920. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 2. Parameter. Rating. Table 3. Thermal Resistance
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ADL5920 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage (VPOS1, VPOS2, and VPOS3) 5.5 V (PCB) design and operating environment. Careful attention to Negative Supply Voltage (VNEG1 and VNEG2) −3 V PCB thermal design is required. Input Average Radio Frequency (RF) Power1 θJA is junction to ambient thermal impedance, and θJC is 50 Ω Load 33 dBm junction to case (exposed pad) thermal impedance. Open or Shorted Load 30 dBm Equivalent Voltage, Sine Wave Input 28.25 V p-p
Table 3. Thermal Resistance
PWDN/TADJS, TADJI, VOCM 0 V, VPOSx
Package Type1 θJA θJC Unit
VTGT 4 V CP-32-7 44.05 1.08 °C/W Maximum Junction Temperature 150°C 1 No airflow with the exposed pad soldered to a 4-layer JEDEC board. Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C
ESD CAUTION
Lead Temperature (Soldering, 60 sec) 300°C 1 Guaranteed by design based on extended duration bench testing at 85°C case temperature Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 8 of 26 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Applications Information Basic Connections CHPR± and CHPF± Capacitors VREF Interface VDIFF Output Interface Temperature Drift Compensation Setting VTGT Choosing Values for CRMSF and CRMSR RF Power and Return Loss Calculation DC-Coupled Operation Evaluation Board Outline Dimensions Ordering Guide
Thermal performance is directly linked to printed circuit board Supply Voltage (VPOS1, VPOS2, and VPOS3) 5.5 V (PCB) design and operating environment. Careful attention to Negative Supply Voltage (VNEG1 and VNEG2) −3 V PCB thermal design is required. Input Average Radio Frequency (RF) Power1 θJA is junction to ambient thermal impedance, and θJC is 50 Ω Load 33 dBm junction to case (exposed pad) thermal impedance. Open or Shorted Load 30 dBm Equivalent Voltage, Sine Wave Input 28.25 V p-p
Table 3. Thermal Resistance
PWDN/TADJS, TADJI, VOCM 0 V, VPOSx
Package Type1 θJA θJC Unit
VTGT 4 V CP-32-7 44.05 1.08 °C/W Maximum Junction Temperature 150°C 1 No airflow with the exposed pad soldered to a 4-layer JEDEC board. Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C
ESD CAUTION
Lead Temperature (Soldering, 60 sec) 300°C 1 Guaranteed by design based on extended duration bench testing at 85°C case temperature Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 8 of 26 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Applications Information Basic Connections CHPR± and CHPF± Capacitors VREF Interface VDIFF Output Interface Temperature Drift Compensation Setting VTGT Choosing Values for CRMSF and CRMSR RF Power and Return Loss Calculation DC-Coupled Operation Evaluation Board Outline Dimensions Ordering Guide