Datasheet VSMY5890X01 (Vishay) - 3
| Fabricante | Vishay |
| Descripción | High Speed Infrared Emitting Diodes, 890 nm, Surface Emitter Technology |
| Páginas / Página | 6 / 3 — VSMY5890X01. BASIC CHARACTERISTICS. REFLOW SOLDER PROFILE. DRYPACK. FLOOR … |
| Formato / tamaño de archivo | PDF / 128 Kb |
| Idioma del documento | Inglés |
VSMY5890X01. BASIC CHARACTERISTICS. REFLOW SOLDER PROFILE. DRYPACK. FLOOR LIFE. DRYING
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VSMY5890X01
www.vishay.com Vishay Semiconductors
BASIC CHARACTERISTICS
(Tamb = 25 °C, unless otherwise specified) Axis Title Axis Title 1000 10000 100 10000 t = 100 μs p ) 90 I = 100 mA F (% ) 80 A ty (m 70 100 1000 tensi 1000 In 60 rrent u ne ne ine ant ne ne ine 50 adi rd C 1st li 2nd li 2nd l 1st li a 2nd li 2nd l 40 10 100 orw 100 F 30 - elative R I F R - 20 l. e 10 I e, r 1 10 0 10 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 750 800 850 900 950 1000 V - Forward Voltage (V) F λ - Wavelength (nm) Fig. 3 - Forward Current vs. Forward Voltage Fig. 5 - Relative Radiant Power vs. Wavelength Axis Title Axis Tit 0° le 10° 20° 10 10000 10000 30° t = 100 μs p tensity ent tensity n 1 1000 In 1000 40° )) A 1.0 ne ne ine isplacem ne 0.9 1st li 50° (100 m 2nd li e 2nd l 2nd li / I 0.8 gular D e 0.1 100 100 elative Radiant 60° n elative Radiant I (I R A R - - - l. l 70° φ e 0.7 e I e,r I e, r 80° 0.01 10 10 1 10 100 0.6 0.4 0.2 0 I - Forward Current (mA) F 1st line Fig. 4 - Relative Radiant Intensity vs. Forward Current Fig. 6 - Relative Radiant Intensity vs. Angular Displacement
REFLOW SOLDER PROFILE DRYPACK
Axis Title Devices are packed in moisture barrier bags (MBB) to 300 10000 prevent the products from moisture absorption during Max. 260 °C transportation and storage. Each bag contains a desiccant. 255 °C 250 245 °C 240 °C 217 °C
FLOOR LIFE
200 1000 Time between soldering and removing from MBB must not Max. 30 s ine ne ne exceed the time indicated in J-STD-020: 150 Moisture sensitivity: level 3 1st li 2nd l 2nd li Max. 120 s Max. 100 s Floor life: 168 h 100 100 Temperature (°C) Max. ramp down 6 °C/s Conditions: Tamb < 30 °C, RH < 60 % 50 Max. ramp up 3 °C/s
DRYING
In case of moisture absorption devices should be baked 0 10 0 50 100 150 200 250 300 before soldering. Conditions see J-STD-033D or label. Time (s) Devices taped on reel dry using recommended conditions 19841 192 h at 40 °C (+ 5 °C), RH < 5 %. Fig. 7 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020 Rev. 1.0, 11-Apr-2019
3
Document Number: 84952 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Semiconductors
BASIC CHARACTERISTICS
(Tamb = 25 °C, unless otherwise specified) Axis Title Axis Title 1000 10000 100 10000 t = 100 μs p ) 90 I = 100 mA F (% ) 80 A ty (m 70 100 1000 tensi 1000 In 60 rrent u ne ne ine ant ne ne ine 50 adi rd C 1st li 2nd li 2nd l 1st li a 2nd li 2nd l 40 10 100 orw 100 F 30 - elative R I F R - 20 l. e 10 I e, r 1 10 0 10 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 750 800 850 900 950 1000 V - Forward Voltage (V) F λ - Wavelength (nm) Fig. 3 - Forward Current vs. Forward Voltage Fig. 5 - Relative Radiant Power vs. Wavelength Axis Title Axis Tit 0° le 10° 20° 10 10000 10000 30° t = 100 μs p tensity ent tensity n 1 1000 In 1000 40° )) A 1.0 ne ne ine isplacem ne 0.9 1st li 50° (100 m 2nd li e 2nd l 2nd li / I 0.8 gular D e 0.1 100 100 elative Radiant 60° n elative Radiant I (I R A R - - - l. l 70° φ e 0.7 e I e,r I e, r 80° 0.01 10 10 1 10 100 0.6 0.4 0.2 0 I - Forward Current (mA) F 1st line Fig. 4 - Relative Radiant Intensity vs. Forward Current Fig. 6 - Relative Radiant Intensity vs. Angular Displacement
REFLOW SOLDER PROFILE DRYPACK
Axis Title Devices are packed in moisture barrier bags (MBB) to 300 10000 prevent the products from moisture absorption during Max. 260 °C transportation and storage. Each bag contains a desiccant. 255 °C 250 245 °C 240 °C 217 °C
FLOOR LIFE
200 1000 Time between soldering and removing from MBB must not Max. 30 s ine ne ne exceed the time indicated in J-STD-020: 150 Moisture sensitivity: level 3 1st li 2nd l 2nd li Max. 120 s Max. 100 s Floor life: 168 h 100 100 Temperature (°C) Max. ramp down 6 °C/s Conditions: Tamb < 30 °C, RH < 60 % 50 Max. ramp up 3 °C/s
DRYING
In case of moisture absorption devices should be baked 0 10 0 50 100 150 200 250 300 before soldering. Conditions see J-STD-033D or label. Time (s) Devices taped on reel dry using recommended conditions 19841 192 h at 40 °C (+ 5 °C), RH < 5 %. Fig. 7 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020 Rev. 1.0, 11-Apr-2019
3
Document Number: 84952 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000