Datasheet ALED1262ZT (STMicroelectronics) - 5
Fabricante | STMicroelectronics |
Descripción | Automotive-grade 12-channel LED driver with open detection, local dimming, busdriven and standalone operations |
Páginas / Página | 69 / 5 — ALED1262ZT. Electrical characteristics |
Formato / tamaño de archivo | PDF / 3.4 Mb |
Idioma del documento | Inglés |
ALED1262ZT. Electrical characteristics
Línea de modelo para esta hoja de datos
Versión de texto del documento
ALED1262ZT Electrical characteristics 4 Electrical characteristics Table 4. Electrical characteristics (VDDA = 12 V, VDDD = 5 V, Tj = -40 to 125 °C, unless otherwise specified) Symbol Parameter Conditions Min. Typ. Max. Unit
VDDA Supply voltage 5.5 38 VDDD Supply voltage 4.5 5.5 VOUT Output voltage OUT0 - OUT11 19 VIH 0.7•VDDD VDDD SDA, SCL digital thresholds VDDD plugged VIL -0.5 0.3•VDDD VIH2 FLG digital input threshold with V 1.70 1.90 DDD not active VIL2 1.30 1.45 VI2_Hys FLG hysteresis 0.25 V VIH3 2.00 GPWM threshold VDDA plugged VIL3 1.70 VIH4 1.90 OTP1/2 threshold VIL4 1.30 VIH5 1.9 2.00 PG threshold VIL5 1.70 1.8 VI5_Hys PG hysteresis 0.1 RCS CS pull-down 160 kΩ II_GPWM GPWM pin input current VGPWM = GND or 2 V -1 +1 II_OTP1/2 OTP1/2 pin input current VOTP1/2 = GND or 2 V -1 +1 µA II_PG PG pin input current VPG = GND or 2 V -1 +1 IOL_SDA SDA sink current VDDD = 4.5 V; VOL = 0.4 V 3 mA IOL_SCL SCL sink current VDDD = 4.5 V; VOL = 0.4 V 3 IDleak SDA, SCL leakage current VI = GND or VDDD -10 +10 µA IOleak Output channel leakage current VOUT = 19 V, all outputs OFF 0.5 VDDD plugged VOH = VDDD-0.4V IOH_FLG FLG source current 3 mA VDDD not plugged VOH = VLDO3-0.4V VUVLO VDDA UVLO threshold (falling) 1.7 1.85 Global_EN VDDA threshold (rising) 3.8 4.0 VG_EN Global_EN VDDA threshold (falling) GPWM = LDO3 3.40 3.6 H V G_EN Global_EN hysteresis 0.2 Vref REXT reference voltage 1.233 External maximum load current: VLDO LDO3 output voltage 3.231 3.328 3.428 Iload = 200 µA ILDO LDO short-circuit output current VDDA = 5.5 V 110 mA
DS12631
-
Rev 4 page 5/69
Document Outline 1 Pin description 2 Absolute maximum ratings 3 Thermal characteristics 4 Electrical characteristics 4.1 Switching characteristics 5 Device pin functions 6 Driver dropout voltage 7 Device functional description 8 Error detection 9 Gradual output delay 10 Thermal warning and protection 11 Device local dimming function 12 Local dimming non-linear step table 13 Register descriptions 13.1 BDM_conf_1 / Enable_CH_1 register 13.2 BDM_conf_2 / Enable_CH_2 register 13.3 BDM_status register 13.4 Faulty_ch_1 register 13.5 Faulty_ch_2 register 13.6 PWM_gain_x register 13.7 LDD register (LED driver device versioning) 13.8 OTP/SAM_conf_1_2 register 13.9 OTP/SAM_conf_1 register 13.10 OTP/SAM_conf_2 register 13.11 OTP/BA_n_SAM_setting register 14 I²C bus operations 14.1 I²C main concepts 15 I²C addressing for the ALED1262ZT 16 I²C selectable Hamming (8, 4) encoding 17 Message structure 17.1 Available commands 17.2 Pattern symbols 17.3 Write operations 17.3.1 BDM configuration register write 17.3.2 FAULTY_ch1[7] bit register write (prescaler) 17.3.3 PWM_gain_x register write 17.3.4 BDM_conf and PWM_gain_x register write 17.3.5 Direct write on registers 17.4 Read operations 17.4.1 Status register 17.4.2 Faulty_ch registers 17.4.3 PWM_gain_x registers 17.4.4 BDM_conf, status, Faulty_ch, PWM_gain_x registers 17.4.5 Direct read from registers 18 OTP operations 18.1 OTP emulate 18.2 OTP burn 18.3 OTP read 19 I²C communication examples 19.1 Communication without parity detection 19.1.1 OTP burning with double zap and read back 19.1.2 All LEDs with power-ON 19.1.3 110 Hz dimming prescaler bit 19.1.4 All LEDs with PWM dimming at 50% (full configuration) 19.1.5 Device status read back 19.1.6 Device full status read back 19.1.7 LDD read back (device identifier) 19.2 Communication with parity detection 19.2.1 All LEDs with power-ON 20 LED supply voltage 21 Higher current requests (outputs in parallel) 22 PCB layout and external component guidelines 22.1 Signal integrity and EMI radiated/conducted immunity 22.2 Radiated emission reduction (EMI) 22.3 Device thermal management 22.4 PCB layout example 23 Package information 23.1 HTSSOP24 exposed pad package information Revision history