Datasheet ADXL375-EP (Analog Devices) - 4

ADXL375-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Acceleration, Any Axis (PCB) design and operating environment. Careful attention to Unpowered 10,000 g PCB thermal design is required. Powered 10,000 g θJA is the natural convection, junction to ambient thermal VS −0.3 V to +3.9 V resistance measured in a one cubic foot sealed enclosure. θJC is VDD I/O −0.3 V to +3.9 V the junction to case thermal resistance. Digital Pins −0.3 V to VDD I/O + 0.3 V or 3.9 V, whichever is less
Table 3. Package Characteristics
Output Short-Circuit Duration Indefinite
Package Type θJA θJC Unit
(Any Pin to Ground) CC-14-11 150 85 °C/W Temperature Range Powered −55°C to +105°C 1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test Storage −65°C to +150°C board. See JEDEC JESD-51. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 4 of 7 Document Outline Features Enhanced Product Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Outline Dimensions Ordering Guide