Datasheet ADR441-EP (Analog Devices) - 4
| Fabricante | Analog Devices |
| Descripción | Ultralow Noise, LDO XFET® 2.5V Voltage Reference w/Current Sink and Source |
| Páginas / Página | 8 / 4 — ADR441-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS. THERMAL … |
| Formato / tamaño de archivo | PDF / 160 Kb |
| Idioma del documento | Inglés |
ADR441-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 2. Parameter. Rating. Table 3. Thermal Resistance
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ADR441-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 2.
Thermal performance is directly linked to printed circuit board
Parameter Rating
(PCB) design and operating environment. Careful attention to Supply Voltage 20 V PCB thermal design is required. Output Short-Circuit Duration to GND Indefinite θJA is the natural convection junction to ambient thermal Storage Temperature Range −65°C to +150°C resistance measured in a one cubic foot sealed enclosure. Operating Temperature Range −55°C to +125°C θJC is the junction to case thermal resistance. Junction Temperature Range −65°C to +150°C Lead Temperature, Soldering (60 sec) 300°C
Table 3. Thermal Resistance
Stresses at or above those listed under Absolute Maximum
Package Type1 θJA θJC Unit
Ratings may cause permanent damage to the product. This is a R-8 130 43 °C/W stress rating only; functional operation of the product at these 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal or any other conditions above those indicated in the operational test board. See JEDEC JESD-51. section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may
ESD CAUTION
affect product reliability. Rev. 0 | Page 4 of 8 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUIT GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 2.
Thermal performance is directly linked to printed circuit board
Parameter Rating
(PCB) design and operating environment. Careful attention to Supply Voltage 20 V PCB thermal design is required. Output Short-Circuit Duration to GND Indefinite θJA is the natural convection junction to ambient thermal Storage Temperature Range −65°C to +150°C resistance measured in a one cubic foot sealed enclosure. Operating Temperature Range −55°C to +125°C θJC is the junction to case thermal resistance. Junction Temperature Range −65°C to +150°C Lead Temperature, Soldering (60 sec) 300°C
Table 3. Thermal Resistance
Stresses at or above those listed under Absolute Maximum
Package Type1 θJA θJC Unit
Ratings may cause permanent damage to the product. This is a R-8 130 43 °C/W stress rating only; functional operation of the product at these 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal or any other conditions above those indicated in the operational test board. See JEDEC JESD-51. section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may
ESD CAUTION
affect product reliability. Rev. 0 | Page 4 of 8 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUIT GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE