link to page 44 DPS368Product Description The DPS368 is a miniaturized Digital Barometric Air Pressure Sensor robust against water, dust and humidity. It offers a high accuracy and a low current consumption, capable of measuring both pressure and temperature. The pressure sensor element is based on a capacitive sensing principle which guarantees high precision during temperature changes. The small package makes the DPS368 ideal for mobile applications and wearable devices. Due to its robustness it can be used in harsh environment. The internal signal processor converts the output from the pressure and temperature sensor elements to 24 bit results. Each unit is individually calibrated, the calibration coefficients calculated during this process are stored in the calibration registers. The coefficients are used in the application to convert the measurement results to high accuracy pressure and temperature values. The result FIFO can store up to 32 measurement results, allowing for a reduced host processor polling rate. Sensor measurements and calibration coefficients are available through the serial I²C or SPI interface. The measurement status is indicated by status bits or interrupts on the SDO pin. Features • Pressure sensor with environmentally resistant package • Operation range: Pressure: 300 –1200 hPa. Temperature: -40 – 85 °C. • Pressure sensor precision: ± 0.002 hPa (or ±0.02 m) (high precision mode). • Relative accuracy: ± 0.06 hPa (or ±0.5 m) • Absolute accuracy: ± 1 hPa (or ±8 m) • IPx8 certified: Temporary immersion of 50m for 1 hour • Temperature accuracy: ± 0.5°C. • Pressure temperature sensitivity: 0.5Pa/K • Measurement time: Typical 27.6 ms for standard mode (16x). Minimum: 3.6 ms for low precision mode. • Average current consumption: 1.7 µA for pressure measurement, 1.5 µA for temperature measurement @1Hz sampling rate, standby: 0.5 µA. • Supply voltage: VDDIO: 1.2 – 3.6 V, VDD: 1.7 – 3.6 V. • Operating modes: Command (manual), Background (automatic), and Standby. • Calibration: Individually calibrated with coefficients for measurement correction. • FIFO: Stores up to 32 pressure or temperature measurements. • Interface: I2C and SPI (both with optional interrupt) • Package dimensions: 8-pin PG-VLGA-8-2 , 2.0 mm x 2.5 mm x 1.1 mm. • Green Product (RoHS) Compliant Preliminary datasheet Please read the Important Notice and Warnings at the end of this document v1.0 www.infineon.com 2019-03-14 Document Outline Product Description Features Typical applications Product Validation Table of contents 1 Definitions, acronyms and abbreviations 1.1 Definitions 2 Pin Configuration and Block Diagram 2.1 Pin Configuration and Description 2.2 Block Diagram 3 Specifications 3.1 Operating Range 3.2 Absolute Maximum Ratings 3.3 Current Consumption 3.4 Temperature Transfer Function 3.5 Pressure Transfer Function 3.6 Timing Characteristics 4 Functional Description 4.1 Operating Modes 4.2 Mode transition diagram 4.3 Start-up sequence 4.4 Measurement Precision and Rate 4.5 Sensor Interface 4.6 Interrupt 4.7 Result Register Operation 4.8 FIFO Operation 4.9 Calibration and Measurement Compensation 4.9.1 How to Calculate Compensated Pressure Values 4.9.2 How to Calculate Compensated Temperature Values 4.9.3 Compensation Scale Factors 4.9.4 Pressure and Temperature calculation flow 5 Applications 5.1 Measurement Settings and Use Case Examples 5.2 Application Circuit Example 5.3 IIR filtering 6 Digital interfaces 6.1 I2C Interface 6.2 SPI Interface 6.3 Interface parameters specification 6.3.1 General interface parameters 6.3.1.1 I2C timings 6.3.1.2 SPI timings 7 Register Map 8 Register description 8.1 Pressure Data (PRS_Bn) 8.1.1 PRS_B2 8.1.2 PRS_B1 8.1.3 PRS_B0 8.2 Temperature Data (TMP_Tn) 8.2.1 TMP_B2 8.2.2 TMP_B1 8.2.3 TMP_B0 8.3 Pressure Configuration (PRS_CFG) 8.4 Temperature Configuration(TMP_CFG) 8.5 Sensor Operating Mode and Status (MEAS_CFG) 8.6 Interrupt and FIFO configuration (CFG_REG) 8.7 Interrupt Status (INT_STS) 8.8 FIFO Status (FIFO_STS) 8.9 Soft Reset and FIFO flush (RESET) 8.10 Product and Revision ID (ID) 8.11 Calibration Coefficients (COEF) 8.12 Coefficient Source 9 Package Dimensions 9.1 Package drawing 10 Footprint and stencil recommendation 11 Reflow soldering and board assembly 12 Package Handling Revision history Disclaimer