Datasheet DPS368 (Infineon) - 3

FabricanteInfineon
DescripciónXENSIV™ DPS368 - ultra small waterproof pressure sensor, environmentally protected against water (IPx8), dust & humidity
Páginas / Página44 / 3 — DPS368. Table of contents. Product Description. Features. Typical …
Revisión01_00
Formato / tamaño de archivoPDF / 3.0 Mb
Idioma del documentoInglés

DPS368. Table of contents. Product Description. Features. Typical applications. Product Validation

DPS368 Table of contents Product Description Features Typical applications Product Validation

Línea de modelo para esta hoja de datos

Versión de texto del documento

link to page 1 link to page 1 link to page 2 link to page 2 link to page 3 link to page 5 link to page 5 link to page 6 link to page 6 link to page 7 link to page 7 link to page 7 link to page 8 link to page 8 link to page 9 link to page 10 link to page 11 link to page 11 link to page 11 link to page 11 link to page 12 link to page 12 link to page 13 link to page 13 link to page 14 link to page 14 link to page 14 link to page 15 link to page 15 link to page 16 link to page 16 link to page 18 link to page 18 link to page 19 link to page 20 link to page 20
DPS368 Table of contents Table of contents Product Description
. 1
Features
. 1
Typical applications
. 2
Product Validation
. .2
Table of contents
. 3
1 Definitions, acronyms and abbreviations
. 5 1.1 Definitions . 5
2 Pin Configuration and Block Diagram
. 6 2.1 Pin Configuration and Description . .6 2.2 Block Diagram . 7
3 Specifications
. 7 3.1 Operating Range . 7 3.2 Absolute Maximum Ratings . .8 3.3 Current Consumption . 8 3.4 Temperature Transfer Function . 9 3.5 Pressure Transfer Function . 10 3.6 Timing Characteristics . 11
4 Functional Description
. .11 4.1 Operating Modes . 11 4.2 Mode transition diagram . 11 4.3 Start-up sequence . 12 4.4 Measurement Precision and Rate . 12 4.5 Sensor Interface . .13 4.6 Interrupt . 13 4.7 Result Register Operation . 14 4.8 FIFO Operation . .14 4.9 Calibration and Measurement Compensation . 14 4.9.1 How to Calculate Compensated Pressure Values . 15 4.9.2 How to Calculate Compensated Temperature Values . 15 4.9.3 Compensation Scale Factors . 16 4.9.4 Pressure and Temperature calculation flow . 16
5 Applications
. .18 5.1 Measurement Settings and Use Case Examples . 18 5.2 Application Circuit Example . 19 5.3 IIR filtering . .20
6 Digital interfaces
. 20 Preliminary datasheet 3 v1.0 2019-03-14 Document Outline Product Description Features Typical applications Product Validation Table of contents 1 Definitions, acronyms and abbreviations 1.1 Definitions 2 Pin Configuration and Block Diagram 2.1 Pin Configuration and Description 2.2 Block Diagram 3 Specifications 3.1 Operating Range 3.2 Absolute Maximum Ratings 3.3 Current Consumption 3.4 Temperature Transfer Function 3.5 Pressure Transfer Function 3.6 Timing Characteristics 4 Functional Description 4.1 Operating Modes 4.2 Mode transition diagram 4.3 Start-up sequence 4.4 Measurement Precision and Rate 4.5 Sensor Interface 4.6 Interrupt 4.7 Result Register Operation 4.8 FIFO Operation 4.9 Calibration and Measurement Compensation 4.9.1 How to Calculate Compensated Pressure Values 4.9.2 How to Calculate Compensated Temperature Values 4.9.3 Compensation Scale Factors 4.9.4 Pressure and Temperature calculation flow 5 Applications 5.1 Measurement Settings and Use Case Examples 5.2 Application Circuit Example 5.3 IIR filtering 6 Digital interfaces 6.1 I2C Interface 6.2 SPI Interface 6.3 Interface parameters specification 6.3.1 General interface parameters 6.3.1.1 I2C timings 6.3.1.2 SPI timings 7 Register Map 8 Register description 8.1 Pressure Data (PRS_Bn) 8.1.1 PRS_B2 8.1.2 PRS_B1 8.1.3 PRS_B0 8.2 Temperature Data (TMP_Tn) 8.2.1 TMP_B2 8.2.2 TMP_B1 8.2.3 TMP_B0 8.3 Pressure Configuration (PRS_CFG) 8.4 Temperature Configuration(TMP_CFG) 8.5 Sensor Operating Mode and Status (MEAS_CFG) 8.6 Interrupt and FIFO configuration (CFG_REG) 8.7 Interrupt Status (INT_STS) 8.8 FIFO Status (FIFO_STS) 8.9 Soft Reset and FIFO flush (RESET) 8.10 Product and Revision ID (ID) 8.11 Calibration Coefficients (COEF) 8.12 Coefficient Source 9 Package Dimensions 9.1 Package drawing 10 Footprint and stencil recommendation 11 Reflow soldering and board assembly 12 Package Handling Revision history Disclaimer