Datasheet MAX1932 (Maxim) - 9
| Fabricante | Maxim |
| Descripción | Digitally Controlled, 0.5% Accurate, Safest APD Bias Supply |
| Páginas / Página | 16 / 9 — Table 1. Compensation Components for Typical Circuits (Figure 2). … |
| Formato / tamaño de archivo | PDF / 239 Kb |
| Idioma del documento | Inglés |
Table 1. Compensation Components for Typical Circuits (Figure 2). INDUCTOR L1. SNS. OUT. COMP. IN, VOUT, IOUT(MAX). (µH). C2 (µF). R1 (
Línea de modelo para esta hoja de datos
Versión de texto del documento
MAX1932 Digitally Controlled, 0.5% Accurate, Safest APD Bias Supply
Table 1. Compensation Components for Typical Circuits (Figure 2) INDUCTOR L1 C R C R C V SNS SNS OUT COMP COMP IN, VOUT, IOUT(MAX) (µH) C2 (µF) R1 (
Ω
) C3 (µF) R7 (k
Ω
) C4 (µF)
5VIN, 40-90VOUT at 2.5mA 100 0.047 806 0.1 20 0.22 5VIN, 20-60VOUT at 2.5mA 150 0.10 806 0.047 15 0.22 5VIN, 20-60VOUT at 5mA 82 0.22 392 0.10 10 0.47 3VIN, 40-90VOUT at 2.5mA 33 0.047 806 0.1 20 0.22 3VIN, 4.5-15VOUT at 2.5mA 220 0.47 806 0.01 7.5 0.47 ware by the system through the on-chip DAC, but can tions to FB as a short as possible. In particular, locate also be accomplished in hardware using an external feedback resistors (R5, R6, and R8) as close to FB as thermistor or IC temperature sensor. Figure 8 shows possible. Use wide, short traces to interconnect large how an NTC thermistor can be connected to make the current paths for N1, D1, L1, C1, C2. Do not share bias voltage increase with temperature. these connections with other signal paths. Refer to the MAX1932 EV kit for a PC board layout example.
PC Board Layout and Grounding
Careful PC board layout is important for minimizing ground bounce and noise. In addition, keep all connec- www.maximintegrated.com Maxim Integrated | 9
Table 1. Compensation Components for Typical Circuits (Figure 2) INDUCTOR L1 C R C R C V SNS SNS OUT COMP COMP IN, VOUT, IOUT(MAX) (µH) C2 (µF) R1 (
Ω
) C3 (µF) R7 (k
Ω
) C4 (µF)
5VIN, 40-90VOUT at 2.5mA 100 0.047 806 0.1 20 0.22 5VIN, 20-60VOUT at 2.5mA 150 0.10 806 0.047 15 0.22 5VIN, 20-60VOUT at 5mA 82 0.22 392 0.10 10 0.47 3VIN, 40-90VOUT at 2.5mA 33 0.047 806 0.1 20 0.22 3VIN, 4.5-15VOUT at 2.5mA 220 0.47 806 0.01 7.5 0.47 ware by the system through the on-chip DAC, but can tions to FB as a short as possible. In particular, locate also be accomplished in hardware using an external feedback resistors (R5, R6, and R8) as close to FB as thermistor or IC temperature sensor. Figure 8 shows possible. Use wide, short traces to interconnect large how an NTC thermistor can be connected to make the current paths for N1, D1, L1, C1, C2. Do not share bias voltage increase with temperature. these connections with other signal paths. Refer to the MAX1932 EV kit for a PC board layout example.
PC Board Layout and Grounding
Careful PC board layout is important for minimizing ground bounce and noise. In addition, keep all connec- www.maximintegrated.com Maxim Integrated | 9