Datasheet ADP1850 (Analog Devices) - 5

Data Sheet ADP1850 ABSOLUTE MAXIMUM RATINGS Table 2.
Stresses at or above those listed under Absolute Maximum
Parameter Rating
Ratings may cause permanent damage to the product. This is a VIN, EN1/EN2, RAMP1/RAMP2 21 V stress rating only; functional operation of the product at these FB1/FB2, COMP1/COMP2, SS1/SS2, TRK1/TRK2, −0.3 V to +6 V or any other conditions above those indicated in the operational FREQ, SYNC, VCCO, VDL, PGOOD1/PGOOD2 section of this specification is not implied. Operation beyond ILIM1/ILIM2, SW1/SW2 to PGND1/PGND2 −0.3 V to +21 V the maximum operating conditions for extended periods may BST1/BST2, DH1/DH2 to PGND1/PGND2 −0.3 V to +28 V affect product reliability. DL1/DL2 to PGND1/PGND2 −0.3V to VCCO + 0.3 V BST1/BST2 to SW1/SW2 −0.3 V to +6 V Absolute maximum ratings apply individually only, not in BST1/BST2 to PGND1/PGND2 32 V combination. Unless otherwise specified, all other voltages are 20 ns Transients referenced to GND. SW1/SW2 to PGND1/PGND2 25 V 20 ns Transients DL1/DL2, SW1/SW2, ILIM1/ILIM2 to −8 V
ESD CAUTION
PGND1/PGND2 20 ns Negative Transients PGND1/PGND2 to AGND −0.3 V to +0.3 V PGND1/PGND2 to AGND 20 ns Transients −8 V to +4 V θJA on Multilayer PCB (Natural Convection)1, 2 32.6°C/W Operating Junction Temperature Range3 −40°C to +125°C Storage Temperature Range −65°C to +150°C Maximum Soldering Lead Temperature 260°C 1 Measured with exposed pad attached to PCB. 2 Junction-to-ambient thermal resistance (θJA) of the package was calculated or simulated on multilayer PCB. 3 The junction temperature, TJ, of the device is dependent on the ambient temperature, TA, the power dissipation of the device, PD, and the junction-to- ambient thermal resistance of the package, θJA. Maximum junction temperature is calculated from the ambient temperature and power dissipation using the formula: TJ = TA + PD × θJA. Rev. C | Page 5 of 32 Document Outline Features Applications General Description Typical Operation Circuit Revision History Specifications Absolute Maximum Ratings ESD Caution Simplified Block Diagram Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Control Architecture Oscillator Frequency Modes of Operation Synchronization Synchronous Rectifier and Dead Time Input Undervoltage Lockout Internal Linear Regulator Overvoltage Protection Power Good Short-Circuit and Current-Limit Protection Shutdown Control Thermal Overload Protection Applications Information Setting the Output Voltage Soft Start Setting the Current Limit Accurate Current-Limit Sensing Setting the Slope Compensation Setting the Current Sense Gain Input Capacitor Selection Input Filter Boost Capacitor Selection Inductor Selection Output Capacitor Selection MOSFET Selection Loop Compensation (Single Phase Operation) Configuration and Loop Compensation (Dual-Phase Operation) Switching Noise and Overshoot Reduction Voltage Tracking Coincident Tracking Ratiometric Tracking Indepdendent Power Stage Input Voltage PCB Layout Guidelines MOSFETs, Input Bulk Capacitor, and Bypass Capacitor High Current and Current Sense Paths Signal Paths PGND Plane Feedback and Current-Limit Sense Paths Switch Node Gate Driver Paths Output Capacitors Typical Operating Circuits Outline Dimensions Ordering Guide