LT1167 ELECTRICAL CHARACTERISTICSThe l denotes the specifications which apply over the full operatingtemperature range, otherwise specifications are at TA = 25°C. VS = ±15V, VCM = 0V, 0°C ≤ TA ≤ 70°C, RL = 2k, unless otherwise noted.LT1167AI/LT1167AI-1LT1167I/LT1167I-1SYMBOL PARAMETERCONDITIONS (NOTE 7)MINTYPMAXMINTYPMAXUNITS PSRR Power Supply Rejection Ratio VS = ±2.3V to ±18V G = 1 l 100 112 95 112 dB G = 10 l 120 125 115 125 dB G = 100 l 125 132 120 132 dB G = 1000 l 128 140 125 140 dB IS Supply Current l 1.1 1.6 1.1 1.6 mA VOUT Output Voltage Swing VS = ±2.3V to ±5V l –VS +1.4 +VS –1.3 –VS +1.4 +VS –1.3 V VS = ±5V to ±18V l –VS +1.6 +VS –1.5 –VS +1.6 +VS –1.5 V IOUT Output Current l 15 20 15 20 mA SR Slew Rate G = 1, VOUT = ±10V l 0.55 0.95 0.55 0.95 V/μs VREF REF Voltage Range (Note 3) l –VS +1.6 +VS –1.6 –VS +1.6 +VS –1.6 V Note 1: Stresses beyond those listed under Absolute Maximum Ratings Note 6: Hysteresis in offset voltage is created by package stress that may cause permanent damage to the device. Exposure to any Absolute differs depending on whether the IC was previously at a higher or lower Maximum Rating condition for extended periods may affect device temperature. Offset voltage hysteresis is always measured at 25°C, but reliability and lifetime. the IC is cycled to 85°C I-grade (or 70°C C-grade) or –40°C I-grade Note 2: Does not include the effect of the external gain resistor RG. (0°C C-grade) before successive measurement. 60% of the parts will Note 3: This parameter is not 100% tested. pass the typical limit on the data sheet. Note 4: The LT1167AC/LT1167C/LT1167AC-1/LT1167C-1 are designed, Note 7: Typical parameters are defined as the 60% of the yield parameter characterized and expected to meet the industrial temperature limits, but distribution. are not tested at –40°C and 85°C. I-grade parts are guaranteed. Note 8: Referred to input. Note 5: This parameter is measured in a high speed automatic tester that does not measure the thermal effects with longer time constants. The magnitude of these thermal effects are dependent on the package used, heat sinking and air flow conditions. 1167fc 6 Document Outline FEATURES DESCRIPTION APPLICATIONS TYPICAL APPLICATION ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION ORDER INFORMATION ELECTRICAL CHARACTERISTICS TYPICAL PERFORMANCE CHARACTERISTICS BLOCK DIAGRAM THEORY OF OPERATION APPLICATIONS INFORMATION TYPICAL APPLICATION PACKAGE DESCRIPTION REVISION HISTORY TYPICAL APPLICATION RELATED PARTS