Datasheet RHK3845MKDICE (Analog Devices) - 10

DICE/DWF SPECIFICATION RH411MK RH411MKDICE Rad Hard die require special handling as compared to standard IC chips. This wand can be made by pushing a small diameter Teflon tubing Rad Hard die are susceptible to surface damage because there is no onto the tip of a steel-tipped wand. The inside diameter of the Teflon silicon nitride passivation as on standard die. Silicon nitride protects tip should match the die size for efficient pickup. The tip of the Teflon the die surface from scratches by its hard and dense properties. The should be cut square and flat to ensure good vacuum to die surface. passivation on Rad Hard die is silicon dioxide that is much “softer” Ensure the Teflon tip remains clean from debris by inspecting under than silicon nitride. stereoscope. LTC recommends that die handling be performed with extreme care so During die attach, care must be exercised to ensure no tweezers touch as to protect the die surface from scratches. If the need arises to move the top of the die. the die around from the chip tray, use a Teflon-tipped vacuum wand. Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on dice performance and lot qualifications via lot sampling test procedures. Dice data sheet is subject to change. Please consult factory for current revision in production.
table 5. electrical test requireMents MIL-STD-883 TEST REQUIREMENTS SUBGROUP PDA Test Notes
The PDA is specified as 5% based on failures from Group A, Subgroup 1, Final Electrical Test Requirements (Method 5004) 1*, 2, 3 tests after cooldown as the final electrical test in accordance with method Group A Test Requirements (Method 5005) 1, 2, 3 5004 of MIL-STD-883. The verified failures of Group A, Subgroup 1, after Group B and D for Class S, 1, 2, 3 burn-in divided by the total number of devices submitted for burn-in in that End Point Electrical Parameters (Method 5005) lot shall be used to determine the percent for the lot. *PDA applies to subgroup 1. See PDA Test Notes. Linear Technology Corporation reserves the right to test to tighter limits than those given. 10 Document Outline Description Typical Application Description absolute Maximum Ratings Dice Pinout Table 1: Dice/DWF Electrical Test Limits Table 2: Electrical Characteristics Table 3: Electrical Characteristics Table 4: Electrical Test Requirements Total Dose Bias Circuit — Run Mode Total Dose Bias Circuit — Shutdown Mode Burn-in Circuit — run mode Typical Performance characteristics DESCRIPTION ABSOLUTE MAXIMUM RATINGS TABLE 1 Dice/DWF Electrical Test Limits TABLE 2 Electrical Characteristics TABLE 3 Electrical Characteristics Table 5. Electrical Test Requirements Total Dose Bias Circuit Burn-In Circuit Typical Performance Characteristics preirradiation Typical Performance Characteristics Post-irradiation Revision History