Datasheet LTM8032 (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | EN55022B Compliant 36V, 2A DC/DC µModule |
| Páginas / Página | 26 / 2 — absoluTe MaxiMuM raTings. (Note 1). pin conFiguraTion. orDer inForMaTion … |
| Formato / tamaño de archivo | PDF / 532 Kb |
| Idioma del documento | Inglés |
absoluTe MaxiMuM raTings. (Note 1). pin conFiguraTion. orDer inForMaTion PART NUMBER. PAD OR BALL FINISH. PART MARKING*. PACKAGE. MSL
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LTM8032
absoluTe MaxiMuM raTings (Note 1)
V PGOOD, SYNC...30V IN, FIN, RUN/SS Voltage ...40V ADJ, RT, SHARE Voltage ...5V BIAS ..25V V VIN + BIAS ...56V OUT, AUX ...10V Current from AUX ..100mA Maximum Junction Temperature (Note 2) .. 125°C Solder Temperature ... 245°C
pin conFiguraTion
TOP VIEW TOP VIEW 1 2 3 4 5 6 7 1 2 3 4 5 6 7 V VOUT GND OUT GND A A B B BANK 1 BANK 1 C C D D E E F F BANK 2 BANK 2 G RT G RT H SHARE H SHARE J BIAS ADJ J BIAS ADJ AUX AUX K PGOOD K PGOOD BANK 3 BANK 3 L L V V FIN RUN/SS SYNC IN FIN RUN/SS SYNC IN LGA PACKAGE BGA PACKAGE 71-LEAD (9mm × 15mm × 2.82mm) 71-LEAD (9mm × 15mm × 3.42mm) T TJMAX = 125°C, θJA = 25.6°C/W, θJCbottom = 11.0°C/W, JMAX = 125°C, θJA = 25.2°C/W, θJCbottom = 10.3°C/W, θ θJCtop = 15.8°C/W, θJB = 11.4°C/W, WEIGHT = 1.2g JCtop = 15.8°C/W, θJB = 11.4°C/W, WEIGHT = 1.2g θ θ VALUES DETERMINED PER JEDEC 51-9, 51-12 VALUES DETERMINED PER JESD51-9
orDer inForMaTion PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE CODE
LTM8032EV#PBF Au (RoHS) LTM8032V e4 LGA 3 –40°C to 125°C LTM8032IV#PBF Au (RoHS) LTM8032V e4 LGA 3 –40°C to 125°C LTM8032MPV#PBF Au (RoHS) LTM8032MPV e4 LGA 3 –55°C to 125°C LTM8032EY#PBF SAC305 (RoHS) LTM8032Y e1 BGA 3 –40°C to 125°C LTM8032IY#PBF SAC305 (RoHS) LTM8032Y e1 BGA 3 –40°C to 125°C LTM8032MPY#PBF SAC305 (RoHS) LTM8032Y e1 BGA 3 –55°C to 125°C LTM8032MPY SnPb (63/37) LTM8032Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Pb-free and Non-Pb-free Part Markings: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8032fg 2 For more information www.linear.com/LTM8032 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Package Photographs Related Parts
absoluTe MaxiMuM raTings (Note 1)
V PGOOD, SYNC...30V IN, FIN, RUN/SS Voltage ...40V ADJ, RT, SHARE Voltage ...5V BIAS ..25V V VIN + BIAS ...56V OUT, AUX ...10V Current from AUX ..100mA Maximum Junction Temperature (Note 2) .. 125°C Solder Temperature ... 245°C
pin conFiguraTion
TOP VIEW TOP VIEW 1 2 3 4 5 6 7 1 2 3 4 5 6 7 V VOUT GND OUT GND A A B B BANK 1 BANK 1 C C D D E E F F BANK 2 BANK 2 G RT G RT H SHARE H SHARE J BIAS ADJ J BIAS ADJ AUX AUX K PGOOD K PGOOD BANK 3 BANK 3 L L V V FIN RUN/SS SYNC IN FIN RUN/SS SYNC IN LGA PACKAGE BGA PACKAGE 71-LEAD (9mm × 15mm × 2.82mm) 71-LEAD (9mm × 15mm × 3.42mm) T TJMAX = 125°C, θJA = 25.6°C/W, θJCbottom = 11.0°C/W, JMAX = 125°C, θJA = 25.2°C/W, θJCbottom = 10.3°C/W, θ θJCtop = 15.8°C/W, θJB = 11.4°C/W, WEIGHT = 1.2g JCtop = 15.8°C/W, θJB = 11.4°C/W, WEIGHT = 1.2g θ θ VALUES DETERMINED PER JEDEC 51-9, 51-12 VALUES DETERMINED PER JESD51-9
orDer inForMaTion PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE CODE
LTM8032EV#PBF Au (RoHS) LTM8032V e4 LGA 3 –40°C to 125°C LTM8032IV#PBF Au (RoHS) LTM8032V e4 LGA 3 –40°C to 125°C LTM8032MPV#PBF Au (RoHS) LTM8032MPV e4 LGA 3 –55°C to 125°C LTM8032EY#PBF SAC305 (RoHS) LTM8032Y e1 BGA 3 –40°C to 125°C LTM8032IY#PBF SAC305 (RoHS) LTM8032Y e1 BGA 3 –40°C to 125°C LTM8032MPY#PBF SAC305 (RoHS) LTM8032Y e1 BGA 3 –55°C to 125°C LTM8032MPY SnPb (63/37) LTM8032Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Pb-free and Non-Pb-free Part Markings: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8032fg 2 For more information www.linear.com/LTM8032 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Package Photographs Related Parts