Datasheet ADuM6200, ADuM6201, ADuM6202 (Analog Devices) - 7

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Data Sheet ADuM6200/ADuM6201/ADuM6202 Table 13. Input and Output Characteristics Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DC SPECIFICATIONS Logic High Input Threshold VIH 0.7 × VISO or V 0.7 × VDD1 Logic Low Input Threshold VIL 0.3 × VISO or V 0.3 × VDD1 Logic High Output Voltages VOH VDD1 − 0.3 or VDD1 or VISO V IOx = −20 μA, VIx = VIxH VISO − 0.3 VDD1 − 0.5 or VDD1 − 0.2 or V IOx = −4 mA, VIx = VIxH VISO − 0.5 VISO − 0.2 Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 μA, VIx = VIxL 0.0 0.4 V IOx = 4 mA, VIx = VIxL Undervoltage Lockout UVLO VDD1, VISO supplies Positive-Going Threshold VUV+ 2.7 V Negative-Going Threshold VUV− 2.4 V Hysteresis VUVH 0.3 V Input Currents per Channel II −20 +0.01 +20 μA 0 V ≤ VIx ≤ VDD1 AC SPECIFICATIONS Output Rise/Fall Time tR/tF 2.5 ns 10% to 90% Common-Mode Transient |CM| 25 35 kV/μs VIx = VDD1 or VISO, VCM = 1000 V, Immunity1 transient magnitude = 800 V Refresh Rate fr 1.0 Mbps 1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.7 × VDD1 or 0.7 × VISO for a high input or VO < 0.3 × VDD1 or 0.3 × VISO for a low input. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
PACKAGE CHARACTERISTICS Table 14. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
RESISTANCE AND CAPACITANCE Resistance (Input-to-Output)1 RI-O 1012 Ω Capacitance (Input-to-Output)1 CI-O 2.2 pF f = 1 MHz Input Capacitance2 CI 4.0 pF IC Junction-to-Ambient Thermal θJA 45 °C/W Thermocouple is located at the center of Resistance the package underside; test conducted on a 4-layer board with thin traces3 THERMAL SHUTDOWN Thermal Shutdown Threshold TSSD 150 °C TJ rising Thermal Shutdown Hysteresis TSSD-HYS 20 °C 1 This device is considered a 2-terminal device; Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together. 2 Input capacitance is from any input data pin to ground. 3 Refer to the Thermal Analysis section for thermal model definitions. Rev. C | Page 7 of 28 Document Outline Features Applications General Description Functional Block Diagrams Table of Contents Revision History Specifications Electrical Characteristics—5 V Primary Input Supply/5 V Secondary Isolated Supply Electrical Characteristics—3.3 V Primary Input Supply/3.3 V Secondary Isolated Supply Electrical Characteristics—5 V Primary Input Supply/3.3 V Secondary Isolated Supply Package Characteristics Regulatory Information Insulation and Safety-Related Specifications Insulation Characteristics IEC 60747-5-2 (VDE 0884 Part 2):2003-01 and DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 Thermal Derating Curve Recommended Operating Conditions Absolute Maximum Ratings ESD Caution Pin Configurations and Function Descriptions Truth Table Typical Performance Characteristics Terminology Applications Information PCB Layout Start-Up Behavior EMI Considerations Propagation Delay Parameters DC Correctness and Magnetic Field Immunity Power Consumption Current-Limit and Thermal Overload Protection Power Considerations Thermal Analysis Increasing Available Power Insulation Lifetime Outline Dimensions Ordering Guide