Datasheet ADIS16465 (Analog Devices) - 8
| Fabricante | Analog Devices |
| Descripción | Precision MEMS IMU Module |
| Páginas / Página | 33 / 8 — Preliminary Technical Data. ADIS16465. ABSOLUTE MAXIMUM RATINGS. THERMAL … |
| Revisión | A |
| Formato / tamaño de archivo | PDF / 566 Kb |
| Idioma del documento | Inglés |
Preliminary Technical Data. ADIS16465. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 3. Parameter Rating
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Preliminary Technical Data ADIS16465 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3.
Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to
Parameter Rating
PCB thermal design is required. Mechanical Shock Survivability Any Axis, Unpowered 2000 g The ADIS16465 is a multichip module that includes many Any Axis, Powered 2000 g active components. The values in Table 4 identify the thermal VDD to GND −0.3 V to +3.6 V response of the hottest component inside of the ADIS16465, Digital Input Voltage to GND −0.3 V to VDD + 0.2 V with respect to the overall power dissipation of the module. Digital Output Voltage to GND −0.3 V to VDD + 0.2 V This approach enables a simple method for predicting the Calibration Temperature Range −40°C to +85°C temperature of the hottest junction, based on either ambient or Operating Temperature Range −40°C to +105°C case temperature. Storage Temperature Range1 −65°C to +150°C For example, when the ambient temperature is 70°C, the hottest Barometric Pressure 2 bar junction temperature (TJ) inside of the ADIS16465 is 76.7°C. 1 Extended exposure to temperatures that are lower than −20°C or higher TJ = θJA × VDD × IDD + 70°C than +85°C can adversely affect the accuracy of the factory calibration. T Stresses at or above those listed under Absolute Maximum J = 158.2°C/W × 3.3 V × 0.044 A + 70°C Ratings may cause permanent damage to the product. This is a TJ = 93°C stress rating only; functional operation of the product at these
Table 4. Package Characteristics
or any other conditions above those indicated in the operational
1 2
section of this specification is not implied. Operation beyond
Package Type θJA θJC Device Weight
the maximum operating conditions for extended periods may ML-44-13 158.2°C/W 106.1°C/W 1.3 g affect product reliability. 1 θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. 2 θJC is the junction to case thermal resistance. 3 Thermal impedance values come from direct observation of the hottest temperature inside of the ADIS16465 when it is attached to an FR4-08 PCB that has two metal layers and has a thickness of 0.063 inches.
ESD CAUTION
Rev. PrA | Page 7 of 32
Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to
Parameter Rating
PCB thermal design is required. Mechanical Shock Survivability Any Axis, Unpowered 2000 g The ADIS16465 is a multichip module that includes many Any Axis, Powered 2000 g active components. The values in Table 4 identify the thermal VDD to GND −0.3 V to +3.6 V response of the hottest component inside of the ADIS16465, Digital Input Voltage to GND −0.3 V to VDD + 0.2 V with respect to the overall power dissipation of the module. Digital Output Voltage to GND −0.3 V to VDD + 0.2 V This approach enables a simple method for predicting the Calibration Temperature Range −40°C to +85°C temperature of the hottest junction, based on either ambient or Operating Temperature Range −40°C to +105°C case temperature. Storage Temperature Range1 −65°C to +150°C For example, when the ambient temperature is 70°C, the hottest Barometric Pressure 2 bar junction temperature (TJ) inside of the ADIS16465 is 76.7°C. 1 Extended exposure to temperatures that are lower than −20°C or higher TJ = θJA × VDD × IDD + 70°C than +85°C can adversely affect the accuracy of the factory calibration. T Stresses at or above those listed under Absolute Maximum J = 158.2°C/W × 3.3 V × 0.044 A + 70°C Ratings may cause permanent damage to the product. This is a TJ = 93°C stress rating only; functional operation of the product at these
Table 4. Package Characteristics
or any other conditions above those indicated in the operational
1 2
section of this specification is not implied. Operation beyond
Package Type θJA θJC Device Weight
the maximum operating conditions for extended periods may ML-44-13 158.2°C/W 106.1°C/W 1.3 g affect product reliability. 1 θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. 2 θJC is the junction to case thermal resistance. 3 Thermal impedance values come from direct observation of the hottest temperature inside of the ADIS16465 when it is attached to an FR4-08 PCB that has two metal layers and has a thickness of 0.063 inches.
ESD CAUTION
Rev. PrA | Page 7 of 32