Datasheet DN2625 (Microchip) - 10
| Fabricante | Microchip |
| Descripción | N-Channel Depletion-Mode Vertical DMOS FET in Single and Dual Options |
| Páginas / Página | 14 / 10 — DN2625 |
| Formato / tamaño de archivo | PDF / 998 Kb |
| Idioma del documento | Inglés |
DN2625
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DN2625
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. DS20005537B-page 10 2017 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics Absolute Maximum Ratings† Temperature Specifications Thermal characteristics 2.0 Typical Performance Curves FIGURE 2-1: Output Characteristics. FIGURE 2-2: Transfer Characteristics. FIGURE 2-3: Saturation Characteristics. FIGURE 2-4: BVDSX Variation with Temperature. FIGURE 2-5: On-resistance vs. Drain Current. FIGURE 2-6: VGS(OFF) and RDS(ON) Variation with Temperature. FIGURE 2-7: Transconductance vs. Drain Current. 3.0 Pin Description TABLE 3-1: TO-252 D-PAK Pin Function Table TABLE 3-2: 8-lead DFN (dual Pad) Pin Function Table 4.0 Functional Description FIGURE 4-1: Switching Waveforms and Test Circuit. Product Summary 5.0 Packaging Information 5.1 Package Marking Information
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. DS20005537B-page 10 2017 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics Absolute Maximum Ratings† Temperature Specifications Thermal characteristics 2.0 Typical Performance Curves FIGURE 2-1: Output Characteristics. FIGURE 2-2: Transfer Characteristics. FIGURE 2-3: Saturation Characteristics. FIGURE 2-4: BVDSX Variation with Temperature. FIGURE 2-5: On-resistance vs. Drain Current. FIGURE 2-6: VGS(OFF) and RDS(ON) Variation with Temperature. FIGURE 2-7: Transconductance vs. Drain Current. 3.0 Pin Description TABLE 3-1: TO-252 D-PAK Pin Function Table TABLE 3-2: 8-lead DFN (dual Pad) Pin Function Table 4.0 Functional Description FIGURE 4-1: Switching Waveforms and Test Circuit. Product Summary 5.0 Packaging Information 5.1 Package Marking Information