Datasheet AD9236 (Analog Devices) - 8

Data Sheet AD9236 ABSOLUTE MAXIMUM RATINGS Table 6. THERMAL RESISTANCE With Parameter Respect to Min Max Unit
θJA is specified for the worst-case conditions on a 4-layer board
ELECTRICAL
in stil air, in accordance with EIA/JESD51-1. AVDD AGND –0.3 +3.9 V
Table 7.
DRVDD DGND –0.3 +3.9 V
Package Type
θ
JA
θ
JC Unit
AGND DGND –0.3 +0.3 V RU-28 67.7 °C/W AVDD DRVDD –3.9 +3.9 V CP-32-7 32.5 32.71 °C/W D0 to D11 DGND –0.3 DRVDD + 0.3 V CLK, MODE AGND –0.3 AVDD + 0.3 V VIN+, VIN– AGND –0.3 AVDD + 0.3 V Airflow increases heat dissipation effectively, reducing θJA. In VREF AGND –0.3 AVDD + 0.3 V addition, more metal directly in contact with the package leads SENSE AGND –0.3 AVDD + 0.3 V from metal traces, through holes, ground, and power planes REFT, REFB AGND –0.3 AVDD + 0.3 V reduces the θJA. It is recommended that the exposed paddle be PDWN AGND –0.3 AVDD + 0.3 V soldered to the ground plane for the LFCSP package. There is
ENVIRONMENTAL
an increased reliability of the solder joints, and maximum Storage Temperature –65 +125 °C thermal capability of the package is achieved with the exposed Operating Temperature Range –40 +85 °C paddle soldered to the customer board. Lead Temperature 300 °C (Soldering 10 sec) Junction Temperature 150 °C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. C | Page 7 of 36 Document Outline Features Applications General Description Functional Block Diagram Product Highlights Revision History DC Specifications AC Specifications Digital Specifications Switching Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Terminology Pin Configurations and Function Descriptions Equivalent Circuits Typical Performance Characteristics Theory of Operation Analog Input and Reference Overview Differential Input Configurations Single-Ended Input Configuration Clock Input Considerations Jitter Considerations Power Dissipation and Standby Mode Digital Outputs Timing Voltage Reference Internal Reference Connection External Reference Operation Operational Mode Selection Evaluation Board TSSOP Evaluation Board LFCSP Evaluation Board Outline Dimensions Ordering Guide