link to page 15 AD7625Data SheetABSOLUTE MAXIMUM RATINGS Table 4.THERMAL RESISTANCEParameter Rating θJA is specified for the worst-case conditions, that is, a device Analog Inputs/Outputs soldered in a circuit board for surface-mount packages. IN+, IN− to GND1 −0.3 V to REF + 0.3 V or ±130 mA Table 5. Thermal Resistance REF2 to GND −0.3 V to +6 V Package TypeθJAθJC Unit VCM, CAP2 to GND −0.3 V to +6 V 32-Lead LFCSP_WQ 40 4 °C/W CAP1, REFIN to GND −0.3 V to +2.7 V Supply Voltage ESD CAUTION VDD1 −0.3 V to +6 V VDD2, VIO −0.3 V to +3 V Digital Inputs to GND −0.3 V to VIO + 0.3 V Digital Outputs to GND −0.3 V to VIO + 0.3 V Input Current to Any Pin Except Supplies3 ±10 mA Operating Temperature Range −40°C to +85°C (Commercial) Storage Temperature Range −65°C to +150°C Junction Temperature 150°C ESD 1 kV 1 See the Analog Inputs section. 2 Keep CNV+/CNV− low for any external REF voltage > 4.3 V applied to the REF pin. 3 Transient currents of up to 100 mA do not cause SCR latch-up. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 6 of 24 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY THEORY OF OPERATION CIRCUIT INFORMATION CONVERTER INFORMATION TRANSFER FUNCTIONS ANALOG INPUTS TYPICAL CONNECTION DIAGRAM DRIVING THE AD7625 Differential Analog Input Source Single-Ended-to-Differential Driver VOLTAGE REFERENCE OPTIONS POWER SUPPLY Power-Up DIGITAL INTERFACE Conversion Control Echoed-Clock Interface Mode Self-Clocked Interface Mode APPLICATIONS INFORMATION LAYOUT, DECOUPLING, AND GROUNDING Exposed Pad VDD1 Supply Routing and Decoupling VIO Supply Decoupling Layout and Decoupling of Pin 25 to Pin 32 OUTLINE DIMENSIONS ORDERING GUIDE NOTES NOTES