Datasheet AD9649 (Analog Devices) - 8

Data Sheet AD9649 SWITCHING SPECIFICATIONS
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty cycle clock, unless otherwise noted.
Table 4. AD9649-20/AD9649-40 AD9649-65 AD9649-80 Parameter Temp Min Typ Max Min Typ Max Min Typ Max Unit
CLOCK INPUT PARAMETERS Input Clock Rate Full 80/160 260 320 MHz Conversion Rate1 Full 3 20/40 3 65 3 80 MSPS CLK Period, Divide-by-1 Mode (tCLK) Full 50/25 15.38 12.5 ns CLK Pulse Width High (tCH) 25.0/12.5 7.69 6.25 ns Aperture Delay (tA) Full 1.0 1.0 1.0 ns Aperture Uncertainty (Jitter, tJ) Full 0.1 0.1 0.1 ps rms DATA OUTPUT PARAMETERS Data Propagation Delay (tPD) Full 3 3 3 ns DCO Propagation Delay (tDCO) Full 3 3 3 ns DCO to Data Skew (tSKEW) Full 0.1 0.1 0.1 ns Pipeline Delay (Latency) Full 8 8 8 Cycles Wake-Up Time2 Full 350 350 350 µs Standby Full 600/400 300 260 ns OUT-OF-RANGE RECOVERY TIME Full 2 2 2 Cycles 1 Conversion rate is the clock rate after the CLK divider. 2 Wake-up time is dependent on the value of the decoupling capacitors.
N – 1 N + 4 tA N + 5 N N + 3 VIN N + 1 N + 2 tCH tCLK CLK+ CLK– tDCO DCO tSKEW DATA N – 8 N – 7 N – 6 N – 5 N – 4
002
tPD
08539- Figure 2. CMOS Output Data Timing Rev. B | Page 7 of 32 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS REVISION HISTORY GENERAL DESCRIPTION SPECIFICATIONS DC SPECIFICATIONS AC SPECIFICATIONS DIGITAL SPECIFICATIONS SWITCHING SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS AD9649-80 AD9649-65 AD9649-40 AD9649-20 EQUIVALENT CIRCUITS THEORY OF OPERATION ANALOG INPUT CONSIDERATIONS Input Common Mode Differential Input Configurations Single-Ended Input Configuration VOLTAGE REFERENCE Internal Reference Connection External Reference Operation CLOCK INPUT CONSIDERATIONS Clock Input Options Input Clock Divider Clock Duty Cycle Jitter Considerations POWER DISSIPATION AND STANDBY MODE DIGITAL OUTPUTS Digital Output Enable Function (OEB) TIMING Data Clock Output (DCO) BUILT-IN SELF-TEST (BIST) AND OUTPUT TEST BUILT-IN SELF-TEST (BIST) OUTPUT TEST MODES SERIAL PORT INTERFACE (SPI) CONFIGURATION USING THE SPI HARDWARE INTERFACE CONFIGURATION WITHOUT THE SPI SPI ACCESSIBLE FEATURES MEMORY MAP READING THE MEMORY MAP REGISTER TABLE OPEN LOCATIONS DEFAULT VALUES Logic Levels Transfer Register Map MEMORY MAP REGISTER TABLE MEMORY MAP REGISTER DESCRIPTIONS USR2 (Register 0x101) Bit 3—Enable GCLK Detect Bit 2—Run GCLK Bit 0—Disable SDIO Pull-Down APPLICATIONS INFORMATION DESIGN GUIDELINES Power and Ground Recommendations Exposed Paddle Thermal Heat Sink Recommendations Encode Clock VCM RBIAS Reference Decoupling SPI Port Soft Reset OUTLINE DIMENSIONS ORDERING GUIDE