Datasheet MCP6491, MCP6492, MCP6494 (Microchip) - 8

FabricanteMicrochip
DescripciónThe Microchip’s MCP6491 operational amplifiers (op amps) has low input bias current (150 pA, typical at 125°C) and rail-to-rail input and output operation
Páginas / Página50 / 8 — MCP6491/2/4. Note:. 1,000. 105. 100. PSRR. (dB). ltage Density. Hz). ¥ …
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MCP6491/2/4. Note:. 1,000. 105. 100. PSRR. (dB). ltage Density. Hz). ¥ 100. (nV/. CMRR @ V. = 5.5V. oise V. MRR, PSRR. @ V. = 2.4V. Input

MCP6491/2/4 Note: 1,000 105 100 PSRR (dB) ltage Density Hz) ¥ 100 (nV/ CMRR @ V = 5.5V oise V MRR, PSRR @ V = 2.4V Input

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MCP6491/2/4 Note:
Unless otherwise indicated, T  A = +25°C, VDD = +2.4V to +5.5V, VSS = GND, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 10 kto VL and CL = 20 pF.
1,000 105 100 PSRR 95 (dB) 90 ltage Density Hz) o ¥ 100 85 (nV/ 80 CMRR @ V = 5.5V oise V MRR, PSRR DD C @ V = 2.4V N 75 DD 70 Input 10 65 1.E-1 1.E+0 1.E+1 1.E+2 0.1 1 10 100 1.E+3 1k 1.E+4 1.E+5 1.E+6 10k 100k 1M -50 -25 0 25 50 75 100 125 Frequency (Hz) Temperature (°C) FIGURE 2-7:
Input Noise Voltage Density
FIGURE 2-10:
CMRR, PSRR vs. Ambient vs. Frequency. Temperature.
30 1000 1n V = 5.5 V 25 DD 100p 100 20 Currents Input Bias Current 10p 10 Hz) ¥ 15 1p (nV/ 1 (A) 10 ltage Noise Density nd Offset o f = 10 kHz a V V = 5 5 . V 0.1p 5 V DD 0.1 Input Offset Current Input 0 0.01 0.01p Input Bias 5 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 25 35 45 55 65 75 85 95 105 11 125 Common Mode Input Voltage (V) Ambient Temperature (°C) FIGURE 2-8:
Input Noise Voltage Density
FIGURE 2-11:
Input Bias, Offset Currents vs. Common Mode Input Voltage. vs. Ambient Temperature.
100 250 Representative Part 90 V = 5.5 V 200 DD 80 PSRR+ T = +125°C A (dB) 150 70 CMRR 60 100 50 Bias Current (pA) RR, PSRR PSRR- t 50 u T = +85 +85°C u A M 40 C Inp 0 30 T = +25°C A -50 20 1.00E+01 1.00E+02 1.00E+03 1.00E+04 1.00E+05 1.00E+06 10 100 1k 10k 100k 1M 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Frequency (Hz) Common Mode Input Voltage (V) FIGURE 2-9:
CMRR, PSRR vs.
FIGURE 2-12:
Input Bias Current vs. Frequency. Common Mode Input Voltage. DS20002321C-page 8  2012-2013 Microchip Technology Inc. Document Outline Package Types Typical Application 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings 1.2 Specifications 1.3 Test Circuits 2.0 Typical Performance Curves Figure 2-1: Input Offset Voltage Figure 2-2: Input Offset Voltage Drift Figure 2-3: Input Offset Voltage vs. Common Mode Input Voltage Figure 2-4: Input Offset Voltage vs. Common Mode Input Voltage Figure 2-5: Input Offset Voltage vs. Output Voltage Figure 2-6: Input Offset Voltage vs. Power Supply Voltage FIGURE 2-7: Input Noise Voltage Density vs. Frequency. FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-16: Quiescent Current vs. Power Supply Voltage. FIGURE 2-17: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-18: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-22: Output Voltage Swing vs. Frequency. FIGURE 2-23: Output Voltage Headroom vs. Output Current. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-27: Slew Rate vs. Ambient Temperature. FIGURE 2-28: Small Signal Non-Inverting Pulse Response. FIGURE 2-29: Small Signal Inverting Pulse Response. FIGURE 2-30: Large Signal Non-Inverting Pulse Response. FIGURE 2-31: Large Signal Inverting Pulse Response. FIGURE 2-32: The MCP6491/2/4 Shows No Phase Reversal. FIGURE 2-33: Closed Loop Output Impedance vs. Frequency. FIGURE 2-34: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-35: Channel-to-Channel Separation vs. Frequency (MCP6492/4 only). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Exposed Thermal Pad (EP) 4.0 Application Information 4.1 Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. Figure 4-3: Protecting the Analog Inputs 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps Figure 4-6: Unused Op Amps. Figure 4-7: Example Guard Ring Layout for Inverting Gain 4.6 PCB Surface Leakage 4.7 Application Circuits FIGURE 4-8: Photovoltaic Mode Detector. FIGURE 4-9: Photoconductive Mode Detector. FIGURE 4-10: Second-Order, Low-Pass Butterworth Filter with Sallen-Key Topology. FIGURE 4-11: Second-Order, Low-Pass Butterworth Filter with Multiple-Feedback Topology. FIGURE 4-12: pH Electrode Amplifier. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab Software 5.3 MAPS (Microchip Advanced Part Selector) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service