Datasheet MCP6041, MCP6042, MCP6043, MCP6044 (Microchip) - 8

FabricanteMicrochip
DescripciónОperational amplifier (op amp) has a gain bandwidth product of 14 kHz with a low typical operating current of 600 nA and an offset voltage that is less than 3 mV
Páginas / Página40 / 8 — MCP6041/2/3/4. Note:. 130. 100. 120. (G = +1). ) 110. (°). arg. tion. …
Formato / tamaño de archivoPDF / 1.2 Mb
Idioma del documentoInglés

MCP6041/2/3/4. Note:. 130. 100. 120. (G = +1). ) 110. (°). arg. tion. (kH. GBWP. el t. ase M. epa. Ban. Gain. DD = 5.0V. Input Referred. L = 100 kΩ. 1.E+02. 1.E+

MCP6041/2/3/4 Note: 130 100 120 (G = +1) ) 110 (°) arg tion (kH GBWP el t ase M epa Ban Gain DD = 5.0V Input Referred L = 100 kΩ 1.E+02 1.E+

Línea de modelo para esta hoja de datos

Versión de texto del documento

MCP6041/2/3/4 Note:
Unless otherwise indicated, T  A = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 1 M to VL, and CL = 60 pF.
130 20 100 t 18 90 120 c PM u el d 16 (G = +1) 80 n ) 110 n B ro 14 70 (°) a P in (d 12 60 100 th Ch z) arg o id tion 10 50 w (kH GBWP ra 90 el t d 8 40 n 6 30 ase M an epa 80 h S Ban 4 20 P Ch V 70 Gain 2 DD = 5.0V 10 R Input Referred L = 100 kΩ 0 0 60 .5 1.E+02 100 1.E+ 1 03 k 1.E+04 10k -0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Frequency (Hz) Common Mode Input Voltage FIGURE 2-19:
Channel-to-Channel
FIGURE 2-22:
Gain Bandwidth Product, Separation vs. Frequency (MCP6042 and Phase Margin vs. Common Mode Input Voltage. MCP6044 only).
18 90 18 90 16 t ct 80 PM 16 PM 80 uc (G = +1) 14 (G = +1) 70 d 14 70 odu °) ( ro (°) Pr 12 60 in P 12 60 in th g h z) 10 50 z) 10 GBWP 50 id H GBWP idt arg w (k 8 Mar w d 40 (kH 8 d 40 se M an 6 30 ase an 6 30 a B h B h 4 P P in 20 4 in 20 a a G 2 10 G 2 10 V V DD = 1.4V DD = 5.5V 0 0 0 0 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 Ambient Temperature (°C) Ambient Temperature (°C) FIGURE 2-20:
Gain Bandwidth Product,
FIGURE 2-23:
Gain Bandwidth Product, Phase Margin vs. Ambient Temperature with Phase Margin vs. Ambient Temperature with V V DD = 1.4V. DD = 5.5V.
0.8 35 TA = -40°C 0.7 30 rrent TA = +25°C t u T n 0.6 ) A = +85°C ) A 25 t C TA = +125°C rre u ier 0.5 e (m 20 C lif p ircui 0.4 t C tud 15 0.3 scent or A/Am T gni A = +125°C 10 0.2 T Sh Ma Quie A = +85°C T 0.1 A = +25°C tput 5 T u A = -40°C O 0.0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Power Supply Voltage (V) Power Supply Voltage (V) FIGURE 2-21:
Quiescent Current vs.
FIGURE 2-24:
Output Short Circuit Current Power Supply Voltage. vs. Power Supply Voltage. DS21669D-page 8  2001-2013 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics FIGURE 1-1: Chip Select (CS) Timing Diagram (MCP6043 only). 1.1 Test Circuits FIGURE 1-2: AC and DC Test Circuit for Most Non-Inverting Gain Conditions. FIGURE 1-3: AC and DC Test Circuit for Most Inverting Gain Conditions. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift with TA = -40°C to +85°C. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 1.4V. FIGURE 2-4: Input Offset Voltage Drift with TA = +85°C to +125°C and VDD = 1.4V. FIGURE 2-5: Input Offset Voltage Drift with TA = +25°C to +125°C and VDD = 5.5V. FIGURE 2-6: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 5.5V. FIGURE 2-7: Input Offset Voltage vs. Output Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: The MCP6041/2/3/4 family shows no phase reversal. FIGURE 2-11: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-12: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-13: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-14: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-15: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-16: Input Bias, Offset Currents vs. Common Mode Input Voltage. FIGURE 2-17: DC Open-Loop Gain vs. Load Resistance. FIGURE 2-18: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-19: Channel-to-Channel Separation vs. Frequency (MCP6042 and MCP6044 only). FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature with VDD = 1.4V. FIGURE 2-21: Quiescent Current vs. Power Supply Voltage. FIGURE 2-22: Gain Bandwidth Product, Phase Margin vs. Common Mode Input Voltage. FIGURE 2-23: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature with VDD = 5.5V. FIGURE 2-24: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-25: Output Voltage Headroom vs. Output Current Magnitude. FIGURE 2-26: Slew Rate vs. Ambient Temperature. FIGURE 2-27: Small Signal Non-inverting Pulse Response. FIGURE 2-28: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-29: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-30: Small Signal Inverting Pulse Response. FIGURE 2-31: Large Signal Non-inverting Pulse Response. FIGURE 2-32: Chip Select (CS) to Amplifier Output Response Time (MCP6043 only). FIGURE 2-33: Input Current vs. Input Voltage (below VSS). FIGURE 2-34: Large Signal Inverting Pulse Response. FIGURE 2-35: Chip Select (CS) Hysteresis (MCP6043 only). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Chip Select Digital Input 3.4 Power Supply Pins 4.0 Applications Information 4.1 Rail-to-Rail Input FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Output Loads and Battery Life 4.4 Capacitive Loads FIGURE 4-3: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-4: Recommended RISO Values for Capacitive Loads. 4.5 MCP6043 Chip Select 4.6 Supply Bypass 4.7 Unused Op Amps FIGURE 4-5: Unused Op Amps. 4.8 PCB Surface Leakage FIGURE 4-6: Example Guard Ring Layout for Inverting Gain. 4.9 Application Circuits FIGURE 4-7: High-Side Battery Current Sensor. FIGURE 4-8: Two Op Amp Instrumentation Amplifier. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 MAPS (Microchip Advanced Part Selector) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service