Datasheet LT1011, LT1011A (Analog Devices) - 17
| Fabricante | Analog Devices |
| Descripción | Voltage Comparator |
| Páginas / Página | 20 / 17 — package DescripTion. Please refer to … |
| Formato / tamaño de archivo | PDF / 296 Kb |
| Idioma del documento | Inglés |
package DescripTion. Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings
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LT1011/LT1011A
package DescripTion Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. H Package 8-Lead TO-5 Metal Can (.230 Inch PCD)
(Reference LTC DWG # 05-08-1321) 0.335 – 0.370
OBSOLETE PACKAGE
(8.509 – 9.398) DIA 0.027 – 0.045 0.305 – 0.335 (0.686 – 1.143) (7.747 – 8.509) 45°TYP 0.040 PIN 1 0.028 – 0.034 (1.016) 0.050 MAX (1.270) 0.165 – 0.185 (0.711 – 0.864) MAX (4.191 – 4.699) 0.230 REFERENCE (5.842) SEATING PLANE PLANE GAUGE TYP PLANE 0.500 – 0.750 0.010 – 0.045* (12.700 – 19.050) H8 (TO-5) 0.230 PCD 1197 (0.254 – 1.143) 0.110 – 0.160 0.016 – 0.021** (2.794 – 4.064) (0.406 – 0.533) INSULATING STANDOFF *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND 0.045" BELOW THE REFERENCE PLANE 0.016 – 0.024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610)
J8 Package 8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
OBSOLETE PACKAGE
CORNER LEADS OPTION 0.405 (4 PLCS) (10.287) 0.005 MAX (0.127) MIN 8 7 6 5 0.023 – 0.045 (0.584 – 1.143) HALF LEAD OPTION 0.025 0.220 – 0.310 0.045 – 0.068 (0.635) (5.588 – 7.874) (1.143 – 1.727) RAD TYP FULL LEAD OPTION 1 2 3 4 0.200 0.300 BSC (5.080) (0.762 BSC) MAX 0.015 – 0.060 (0.381 – 1.524) 0.008 – 0.018 0° – 15° (0.203 – 0.457) 0.045 – 0.065 0.125 NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE (1.143 – 1.651) 3.175 OR TIN PLATE LEADS 0.014 – 0.026 MIN 0.100 (0.360 – 0.660) (2.54) BSC J8 1298 1011afe For more information www.linear.com/LT1011 17 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Applications Information Typical Applications Schematic Diagram Package Description Revision History Typical Application Related Parts
package DescripTion Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. H Package 8-Lead TO-5 Metal Can (.230 Inch PCD)
(Reference LTC DWG # 05-08-1321) 0.335 – 0.370
OBSOLETE PACKAGE
(8.509 – 9.398) DIA 0.027 – 0.045 0.305 – 0.335 (0.686 – 1.143) (7.747 – 8.509) 45°TYP 0.040 PIN 1 0.028 – 0.034 (1.016) 0.050 MAX (1.270) 0.165 – 0.185 (0.711 – 0.864) MAX (4.191 – 4.699) 0.230 REFERENCE (5.842) SEATING PLANE PLANE GAUGE TYP PLANE 0.500 – 0.750 0.010 – 0.045* (12.700 – 19.050) H8 (TO-5) 0.230 PCD 1197 (0.254 – 1.143) 0.110 – 0.160 0.016 – 0.021** (2.794 – 4.064) (0.406 – 0.533) INSULATING STANDOFF *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND 0.045" BELOW THE REFERENCE PLANE 0.016 – 0.024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610)
J8 Package 8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
OBSOLETE PACKAGE
CORNER LEADS OPTION 0.405 (4 PLCS) (10.287) 0.005 MAX (0.127) MIN 8 7 6 5 0.023 – 0.045 (0.584 – 1.143) HALF LEAD OPTION 0.025 0.220 – 0.310 0.045 – 0.068 (0.635) (5.588 – 7.874) (1.143 – 1.727) RAD TYP FULL LEAD OPTION 1 2 3 4 0.200 0.300 BSC (5.080) (0.762 BSC) MAX 0.015 – 0.060 (0.381 – 1.524) 0.008 – 0.018 0° – 15° (0.203 – 0.457) 0.045 – 0.065 0.125 NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE (1.143 – 1.651) 3.175 OR TIN PLATE LEADS 0.014 – 0.026 MIN 0.100 (0.360 – 0.660) (2.54) BSC J8 1298 1011afe For more information www.linear.com/LT1011 17 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Applications Information Typical Applications Schematic Diagram Package Description Revision History Typical Application Related Parts