Datasheet TLV2370, TLV2371, TLV2372, TLV2373, TLV2374, TLV2375 (Texas Instruments)
| Fabricante | Texas Instruments |
| Descripción | TLV237x 500-µA/Ch, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers With Shutdown |
| Páginas / Página | 59 / 1 — TLV2370,. TLV2371. , TLV2372. TLV2373,. TLV2374. , TLV2375. TLV237x … |
| Revisión | F |
| Formato / tamaño de archivo | PDF / 2.4 Mb |
| Idioma del documento | Inglés |
TLV2370,. TLV2371. , TLV2372. TLV2373,. TLV2374. , TLV2375. TLV237x 500-µA/Ch, 3-MHz Rail-to-Rail Input and Output
Versión de texto del documento
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TLV2370, TLV2371 , TLV2372 TLV2373, TLV2374 , TLV2375
SLOS270F – MARCH 2001 – REVISED AUGUST 2016
TLV237x 500-µA/Ch, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers With Shutdown 1 Features 3 Description
• Rail-to-Rail Input and Output The TLV237x single-supply operational amplifiers 1 provide rail-to-rail input and output capability. The • Wide Bandwidth: 3 MHz TLV237x takes the minimum operating supply voltage • High Slew Rate: 2.4 V/μs down to 2.7 V over the extended industrial • Supply Voltage Range: 2.7 V to 16 V temperature range while adding the rail-to-rail output swing feature. The TLV237x also provides 3-MHz • Supply Current: 550 μA/Channel bandwidth from only 550 μA. The maximum • Low-Power Shutdown Mode recommended supply voltage is 16 V, which allows – IDD(SHDN): 25 μA/Channel the devices to be operated from (±8-V supplies down • Input Noise Voltage: 39 nV/√Hz to ±1.35 V) a variety of rechargeable cells. • Input Bias Current: 1 pA The CMOS inputs enable use in high-impedance • Specified Temperature Range: sensor interfaces, with the lower voltage operation making an ideal alternative for the TLC227x in – −40°C to +125°C (Industrial Grade) battery-powered applications. The rail-to-rail input • Ultra-Small Packaging: stage further increases its versatility. The TLV237x is – 5- or 6-Pin SOT-23 (TLV2370, TLV2371) the seventh member of a rapidly growing number of RRIO products available from TI, and it is the first to – 8- or 10-Pin MSOP (TLV2372, TLV2373) allow operation up to 16-V rails with good ac performance.
2 Applications
All members are available in PDIP and SOIC with the • White Goods singles in the small SOT-23 package, duals in the • Handheld Test Equipment MSOP, and quads in the TSSOP package. • Portable Blood Glucose Systems The 2.7-V operation makes the TLV237x compatible • Remote Sensing with Li-Ion powered systems and the operating supply • Active Filters voltage range of many micro-power microcontrollers available today including TI’s MSP430. • Industrial Automation • Battery-Powered Electronics
Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) Operational Amplifier
PDIP (8) 9.81 mm × 6.35 mm PDIP (14) 19.30 mm × 6.35 mm − SOIC (8) 4.90 mm × 3.91 mm SOIC (14) 8.65 mm × 3.91 mm + TSSOP (14) TLV237x 5.00 mm × 4.40 mm TSSOP (16) SOT-23 (6) 2.90 mm × 1.60 mm SOT-23 (5) VSSOP (8) 3.00 mm × 3.00 mm VSSOP (10) (1) For all available packages, see the orderable addendum at the end of the data sheet. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Tables 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 Recommended Operating Conditions 7.3 Thermal Information: TLV2370 7.4 Thermal Information: TLV2371 7.5 Thermal Information: TLV2372 7.6 Thermal Information: TLV2373 7.7 Thermal Information: TLV2374 7.8 Thermal Information: TLV2375 7.9 Electrical Characteristics 7.10 Typical Characteristics 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Rail-to-Rail Input Operation 8.3.2 Driving a Capacitive Load 8.3.3 Offset Voltage 8.3.4 General Configurations 8.3.5 Shutdown Function 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 11.3 Power Dissipation Considerations 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation 12.2 Related Links 12.3 Receiving Notification of Documentation Updates 12.4 Community Resources 12.5 Trademarks 12.6 Electrostatic Discharge Caution 12.7 Glossary 13 Mechanical, Packaging, and Orderable Information
TLV2370, TLV2371 , TLV2372 TLV2373, TLV2374 , TLV2375
SLOS270F – MARCH 2001 – REVISED AUGUST 2016
TLV237x 500-µA/Ch, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers With Shutdown 1 Features 3 Description
• Rail-to-Rail Input and Output The TLV237x single-supply operational amplifiers 1 provide rail-to-rail input and output capability. The • Wide Bandwidth: 3 MHz TLV237x takes the minimum operating supply voltage • High Slew Rate: 2.4 V/μs down to 2.7 V over the extended industrial • Supply Voltage Range: 2.7 V to 16 V temperature range while adding the rail-to-rail output swing feature. The TLV237x also provides 3-MHz • Supply Current: 550 μA/Channel bandwidth from only 550 μA. The maximum • Low-Power Shutdown Mode recommended supply voltage is 16 V, which allows – IDD(SHDN): 25 μA/Channel the devices to be operated from (±8-V supplies down • Input Noise Voltage: 39 nV/√Hz to ±1.35 V) a variety of rechargeable cells. • Input Bias Current: 1 pA The CMOS inputs enable use in high-impedance • Specified Temperature Range: sensor interfaces, with the lower voltage operation making an ideal alternative for the TLC227x in – −40°C to +125°C (Industrial Grade) battery-powered applications. The rail-to-rail input • Ultra-Small Packaging: stage further increases its versatility. The TLV237x is – 5- or 6-Pin SOT-23 (TLV2370, TLV2371) the seventh member of a rapidly growing number of RRIO products available from TI, and it is the first to – 8- or 10-Pin MSOP (TLV2372, TLV2373) allow operation up to 16-V rails with good ac performance.
2 Applications
All members are available in PDIP and SOIC with the • White Goods singles in the small SOT-23 package, duals in the • Handheld Test Equipment MSOP, and quads in the TSSOP package. • Portable Blood Glucose Systems The 2.7-V operation makes the TLV237x compatible • Remote Sensing with Li-Ion powered systems and the operating supply • Active Filters voltage range of many micro-power microcontrollers available today including TI’s MSP430. • Industrial Automation • Battery-Powered Electronics
Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) Operational Amplifier
PDIP (8) 9.81 mm × 6.35 mm PDIP (14) 19.30 mm × 6.35 mm − SOIC (8) 4.90 mm × 3.91 mm SOIC (14) 8.65 mm × 3.91 mm + TSSOP (14) TLV237x 5.00 mm × 4.40 mm TSSOP (16) SOT-23 (6) 2.90 mm × 1.60 mm SOT-23 (5) VSSOP (8) 3.00 mm × 3.00 mm VSSOP (10) (1) For all available packages, see the orderable addendum at the end of the data sheet. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Tables 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 Recommended Operating Conditions 7.3 Thermal Information: TLV2370 7.4 Thermal Information: TLV2371 7.5 Thermal Information: TLV2372 7.6 Thermal Information: TLV2373 7.7 Thermal Information: TLV2374 7.8 Thermal Information: TLV2375 7.9 Electrical Characteristics 7.10 Typical Characteristics 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Rail-to-Rail Input Operation 8.3.2 Driving a Capacitive Load 8.3.3 Offset Voltage 8.3.4 General Configurations 8.3.5 Shutdown Function 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 11.3 Power Dissipation Considerations 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation 12.2 Related Links 12.3 Receiving Notification of Documentation Updates 12.4 Community Resources 12.5 Trademarks 12.6 Electrostatic Discharge Caution 12.7 Glossary 13 Mechanical, Packaging, and Orderable Information