Datasheet OPA2333, OPA333 (Texas Instruments) - 5

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OPA333, OPA2333 www.ti.com
SBOS351E – MARCH 2006 – REVISED DECEMBER 2015
6 Specifications 6.1 Absolute Maximum Ratings
See (1)
MIN MAX UNIT
Supply 7 Voltage V Signal input terminals(2) –0.3 (V+) + 0.3 Signal input terminals(2) –1 1 Current mA Output short-circuit(3) Continuous Operating junction temperature, TJ 150 Operating temperature, TA –40 150 °C Storage temperature, Tstg –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should be current limited to 10 mA or less. (3) Short-circuit to ground, one amplifier per package.
6.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 Electrostatic V(ESD) V discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage, VS 1.8 5.5 V Specified temperature –40 125 °C Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: OPA333 OPA2333 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information: OPA333 6.5 Thermal Information: OPA2333 6.6 Electrical Characteristics 6.7 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Operating Voltage 7.3.2 Input Voltage 7.3.3 Internal Offset Correction 7.3.4 Achieving Output Swing to the Op Amp Negative Rail 7.3.5 DFN Package 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Applications 8.2.1 High-Side Voltage-to-Current (V-I) Converter 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curve 8.2.2 Precision, Low-Level Voltage-to-Current (V-I) Converter 8.2.2.1 Design Requirements 8.2.2.2 Detailed Design Procedure 8.2.2.3 Application Curves 8.2.3 Composite Amplifier 8.2.3.1 Design Requirements 8.2.3.2 Detailed Design Procedure 8.2.3.3 Application Curve 8.3 System Examples 8.3.1 Temperature Measurement Application 8.3.2 Single Operational Amplifier Bridge Amplifier Application 8.3.3 Low-Side Current Monitor Application 8.3.4 Other Applications 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.1.1 General Layout Guidelines 10.1.2 DFN Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.2 Documentation Support 11.2.1 Related Documentation 11.3 Related Links 11.4 Community Resources 11.5 Trademarks 11.6 Electrostatic Discharge Caution 11.7 Glossary 12 Mechanical, Packaging, and Orderable Information