Datasheet CD54HC14, CD74HC14, CD54HCT14, CD74HCT14 (Texas Instruments) - 7
| Fabricante | Texas Instruments |
| Descripción | High-Speed CMOS Logic Hex Inverting Schmitt Trigger |
| Páginas / Página | 19 / 7 — PACKAGE OPTION ADDENDUM. Orderable Device. Status. Package Type Package … |
| Revisión | F |
| Formato / tamaño de archivo | PDF / 813 Kb |
| Idioma del documento | Inglés |
PACKAGE OPTION ADDENDUM. Orderable Device. Status. Package Type Package Pins Package. Eco Plan. Lead/Ball Finish. MSL Peak Temp
Versión de texto del documento
PACKAGE OPTION ADDENDUM
www.ti.com 10-Jun-2014
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1)
Drawing Qty
(2) (6) (3) (4/5) CD74HCT14E ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT14E (RoHS) CD74HCT14M ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14M96 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14M96E4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14M96G4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14ME4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14MG4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14MT ACTIVE SOIC D 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14PW ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HK14 & no Sb/Br) CD74HCT14PWR ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HK14 & no Sb/Br) CD74HCT14PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HK14 & no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 2
www.ti.com 10-Jun-2014
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1)
Drawing Qty
(2) (6) (3) (4/5) CD74HCT14E ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT14E (RoHS) CD74HCT14M ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14M96 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14M96E4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14M96G4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14ME4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14MG4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14MT ACTIVE SOIC D 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT14M & no Sb/Br) CD74HCT14PW ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HK14 & no Sb/Br) CD74HCT14PWR ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HK14 & no Sb/Br) CD74HCT14PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HK14 & no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 2