Datasheet LM6181 (Texas Instruments) - 4

LM6181
SNOS634C – MAY 1998 – REVISED SEPTEMBER 2014
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings(1)(2)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply Voltage ±18 V Differential Input Voltage ±6 V Input Voltage ±Supply V Voltage Inverting Input Current 15 mA PDIP Package Soldering (10 sec) 260 °C Soldering Information Vapor Phase (60 seconds) 215 °C SOIC Package Infrared (15 seconds) 220 °C Output Short Circuit See(3) Maximum Junction Temperature 150 °C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions the device is intended to be functional, but device parameter specifications may not be ensured under these conditions. For ensured specifications and test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±130 mA over a long term basis may adversely affect reliability.
6.2 Handling Ratings MIN MAX UNIT
Tstg Storage temperature range −65 +150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all ±3000 V(ESD) Electrostatic discharge V pins(1) (1) JEDEC document JEP155 states that 3000-V HBM allows safe manufacturing with a standard ESD control process. Human body model 100 pF and 1.5 kΩ.
6.3 Recommended Operating Conditions(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply Voltage Range 7 32 V LM6181AM −55 +125 °C Operating Temperature Range LM6181AI, LM6181I −40 +85 °C (1) For ensured Military Temperature Range parameters see RETS6181X.
6.4 Thermal Information P D D (PDIP) (SOIC) (SOIC) THERMAL METRIC(1)(2) UNIT 8 PINS 8 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 102 153 70 °C/W RθJC(top) Junction-to-case (top) thermal resistance 42 42 38 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The typical junction-to-ambient thermal resistance of the molded PDIP package soldered directly into a PC board is 102°C/W. The junction-to-ambient thermal resistance of the SOIC package mounted flush to the PC board is 70°C/W when pins 1, 4, 8, 9 and 16 are soldered to a total 2 in2 1 oz. copper trace. The 16-pin SOIC package must have pin 4 and at least one of pins 1, 8, 9, or 16 connected to V− for proper operation. The typical junction-to-ambient thermal resistance of the SOIC package soldered directly into a PC board is 153°C/W." 4 Submit Documentation Feedback Copyright © 1998–2014, Texas Instruments Incorporated Product Folder Links: LM6181 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 Handling Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 ±15V DC Electrical Characteristics 6.6 ±15V AC Electrical Characteristics 6.7 ±5V DC Electrical Characteristics 6.8 ±5V AC Electrical Characteristics 6.9 Typical Performance Characteristics 7 Typical Applications 7.1 Current Feedback Topology 7.2 Power Supply Bypassing and Layout Considerations 7.3 Feedback Resistor Selection: Rf 7.4 Slew Rate Considerations 7.5 Driving Capacitive Loads 7.6 Capacitive Feedback 8 Application and Implementation 8.1 Typical Application 8.1.1 Typical Performance Characteristics 8.1.1.1 Overdrive Recovery 9 Device and Documentation Support 9.1 Trademarks 9.2 Electrostatic Discharge Caution 9.3 Glossary 10 Mechanical, Packaging, and Orderable Information