Datasheet BF862 (NXP) - 8
| Fabricante | NXP |
| Descripción | N-channel junction FET |
| Páginas / Página | 11 / 8 — PACKAGE OUTLINE. Plastic surface-mounted package; 3 leads. SOT23. … |
| Formato / tamaño de archivo | PDF / 239 Kb |
| Idioma del documento | Inglés |
PACKAGE OUTLINE. Plastic surface-mounted package; 3 leads. SOT23. DIMENSIONS (mm are the original dimensions). UNIT. max
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NXP Semiconductors Product specification N-channel junction FET BF862
PACKAGE OUTLINE Plastic surface-mounted package; 3 leads SOT23
D B E A X HE v M A
3
Q A A1
1 2
c e1 bp w M B Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A bp c D E e e v max. 1 HE Lp Q w
1.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55 mm 0.1 1.9 0.95 0.2 0.1 0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC JEITA
04-11-04 SOT23 TO-236AB 06-03-16 2000 Jan 05 8 Document Outline Features Applications Description Pinning SOT23 Quick reference data Limiting values Thermal characteristics Static characteristics Dynamic characteristics Package outline Data sheet status Definitions Disclaimers
PACKAGE OUTLINE Plastic surface-mounted package; 3 leads SOT23
D B E A X HE v M A
3
Q A A1
1 2
c e1 bp w M B Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A bp c D E e e v max. 1 HE Lp Q w
1.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55 mm 0.1 1.9 0.95 0.2 0.1 0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC JEITA
04-11-04 SOT23 TO-236AB 06-03-16 2000 Jan 05 8 Document Outline Features Applications Description Pinning SOT23 Quick reference data Limiting values Thermal characteristics Static characteristics Dynamic characteristics Package outline Data sheet status Definitions Disclaimers