Datasheet MCP6561, MCP6561R, MCP6561U, MCP6562, MCP6564 (Microchip)

MCP6561/1R/1U/2/4 1.8V Low-Power Push-Pull Output Comparator Features Description
• Propagation Delay at 1.8VDD: The Microchip Technology, Inc. MCP6561/1R/1U/2/4 - 56 ns (typical) High-to-Low families of CMOS/TTL compatible comparators are - 49 ns (typical) Low-to-High offered in single, dual, and quad configurations. • Low Quiescent Current: 100 µA (typical) These comparators are optimized for low power 1.8V, • Input Offset Voltage: ±3 mV (typical) single-supply applications with greater than rail-to-rail input operation. The internal input hysteresis eliminates • Rail-to-Rail Input: VSS - 0.3V to VDD + 0.3V output switching due to internal input noise voltage, • CMOS/TTL-Compatible Output reducing current draw. The push-pull output of the • Wide Supply Voltage Range: 1.8V to 5.5V MCP6561/1R/1U/2/4 family supports rail-to-rail output • Available in Single, Dual, and Quad swing, and interfaces with CMOS/TTL logic. The output • Packages: SC70-5, SOT-23-5, SOIC, MSOP, toggle frequency can reach a typical of 4 MHz (typical) TSSOP while limiting supply current surges and dynamic power consumption during switching.
Typical Applications
This family operates with single supply voltage of 1.8V to 5.5V while drawing less than 100 µA/comparator of • Laptop Computers quiescent current (typical). • Mobile Phones • Hand-held Electronics
Package Types
• RC Timers • Alarm and Monitoring Circuits
MCP6561 MCP6562
• Window Comparators SOT-23-5, SC70-5 SOIC, MSOP • Multivibrators OUT 1 5 VDD OUTA 1 8 VDD VSS 2 + - -INA 2 - + 7 OUTB
Design Aids
+IN 3 4 -IN +INA 3 + - 6 -INB V 4 +INB • Microchip Advanced Part Selector (MAPS) SS 5 • Analog Demonstration and Evaluation Boards
MCP6561R MCP6564
• Application Notes SOT-23-5 SOIC, TSSOP OUT 1 5 VSS OUTA 1 14 OUTD
Related Devices
VDD 2 + - -INA 2 - + + - 13 -IND • Open-Drain Output: MCP6566/6R/6U/7/9 +IN 3 4 -IN +INA 3 12 +IND V 4 V DD 11 SS
Typical Application
+INB 5 10 +INC - + - V VDD
MCP6561U
-INB 6 + 9 -INC IN SOT-23-5 OUTB 7 8 OUTC VOUT V V IN+ 1 + 5 DD VDD
MCP656X
VSS 2 - VIN– 3 4 OUT R2 RF R3  2009-2013 Microchip Technology Inc. DS22139C-page 1 Document Outline MCP6561/1R/1U/2/4 1.0 Electrical Characteristics 1.1 Maximum Ratings 1.2 Test Circuit Configuration FIGURE 1-1: AC and DC Test Circuit for the Push-Pull Output Comparators. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input vs. Output Signal, No Phase Reversal. FIGURE 2-4: Input Hysteresis Voltage. FIGURE 2-5: Input Hysteresis Voltage Drift - Linear Temp. Co. (TC1). FIGURE 2-6: Input Hysteresis Voltage Drift - Quadratic Temp. Co. (TC2). FIGURE 2-7: Input Offset Voltage vs. Temperature. FIGURE 2-8: Input Offset Voltage vs. Common-mode Input Voltage. FIGURE 2-9: Input Offset Voltage vs. Common-mode Input Voltage. FIGURE 2-10: Input Hysteresis Voltage vs. Temperature. FIGURE 2-11: Input Hysteresis Voltage vs. Common-mode Input Voltage. FIGURE 2-12: Input Hysteresis Voltage vs. Common-mode Input Voltage. FIGURE 2-13: Input Offset Voltage vs. Supply Voltage vs. Temperature. FIGURE 2-14: Quiescent Current. FIGURE 2-15: Quiescent Current vs. Common-mode Input Voltage. FIGURE 2-16: Input Hysteresis Voltage vs. Supply Voltage vs. Temperature. FIGURE 2-17: Quiescent Current vs. Supply Voltage vs Temperature. FIGURE 2-18: Quiescent Current vs. Common-mode Input Voltage. FIGURE 2-19: Quiescent Current vs. Toggle Frequency. FIGURE 2-20: Output Headroom vs. Output Current. FIGURE 2-21: Low-to-High and High-to- Low Propagation Delays. FIGURE 2-22: Short Circuit Current vs. Supply Voltage vs. Temperature. FIGURE 2-23: Output Headroom vs.Output Current. FIGURE 2-24: Low-to-High and High-to- Low Propagation Delays . FIGURE 2-25: Propagation Delay Skew. FIGURE 2-26: Propagation Delay vs. Supply Voltage. FIGURE 2-27: Propagation Delay vs. Common-mode Input Voltage. FIGURE 2-28: Propagation Delay vs. Temperature. FIGURE 2-29: Propagation Delay vs. Input Over-Drive. FIGURE 2-30: Propagation Delay vs. Common-mode Input Voltage. FIGURE 2-31: Propagation Delay vs. Capacitive Load. FIGURE 2-32: Input Bias Current vs. Input Voltage vs Temperature. FIGURE 2-33: Common-mode Rejection Ratio and Power Supply Rejection Ratio vs. Temperature. FIGURE 2-34: Power Supply Rejection Ratio (PSRR). FIGURE 2-35: Common-mode Rejection Ratio (CMRR). FIGURE 2-36: Common-mode Rejection Ratio (CMRR). FIGURE 2-37: Output Jitter vs. Input Frequency. FIGURE 2-38: Input Offset Current and Input Bias Current vs. Temperature. FIGURE 2-39: Input Offset Current and Input Bias Current vs. Common-mode Input Voltage vs. Temperature. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Inputs 3.2 Digital Outputs 3.3 Power Supply (VSS and VDD) 4.0 Applications Information 4.1 Comparator Inputs 4.1.1 Normal Operation FIGURE 4-1: The MCP6561/1R/1U/2/4 Comparators’ Internal Hysteresis Eliminates Output Chatter Caused by Input Noise Voltage. 4.1.2 Input Voltage and Current Limits FIGURE 4-2: Simplified Analog Input ESD Structures. FIGURE 4-3: Protecting the Analog Inputs. 4.1.3 Phase Reversal 4.2 Push-Pull Output 4.3 Externally Set Hysteresis 4.3.1 Non-Inverting Circuit FIGURE 4-4: Non-inverting Circuit with Hysteresis for Single-Supply. FIGURE 4-5: Hysteresis Diagram for the Non-inverting Circuit. 4.3.2 Inverting Circuit FIGURE 4-6: Inverting Circuit With Hysteresis. FIGURE 4-7: Hysteresis Diagram for the Inverting Circuit. FIGURE 4-8: Thevenin Equivalent Circuit. 4.4 Bypass Capacitors 4.5 Capacitive Loads 4.6 PCB Surface Leakage FIGURE 4-9: Example Guard Ring Layout for Inverting Circuit. 4.7 PCB Layout Technique FIGURE 4-10: Recommended Layout. 4.8 Unused Comparators FIGURE 4-11: Unused Comparators. 4.9 Typical Applications 4.9.1 Precise Comparator FIGURE 4-12: Precise Inverting Comparator. 4.9.2 Windowed Comparator FIGURE 4-13: Windowed Comparator. 4.9.3 Bistable Multivibrator FIGURE 4-14: Bistable Multivibrator. 5.0 Design Aids 5.1 Microchip Advanced Part Selector (MAPS) 5.2 Analog Demonstration and Evaluation Boards 5.3 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service