Datasheet REF35 (Texas Instruments) - 10

FabricanteTexas Instruments
Descripción650-nA quiescent current, 12-ppm/°C drift, ultra-low-power precision voltage reference
Páginas / Página44 / 10 — REF35. www.ti.com. 6.7 Typical Characteristics (continued). Figure 6-13. …
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REF35. www.ti.com. 6.7 Typical Characteristics (continued). Figure 6-13. 0.1Hz to 10Hz Noise Distribution

REF35 www.ti.com 6.7 Typical Characteristics (continued) Figure 6-13 0.1Hz to 10Hz Noise Distribution

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REF35
SNAS809C – DECEMBER 2021 – REVISED SEPTEMBER 2024
www.ti.com 6.7 Typical Characteristics (continued)
at TA = 25°C, VIN = VEN = VREF + 0.3V, IL = 0mA, CL = 10µF, CIN = 0.1µF (unless otherwise noted) 40 40 CL= 10uF CL = 10uF CL = 1uF CL = 1uF 32 32 24 24 ation (%) ation (%) 16 16 Popul Popul 8 8 0 0 1.2 2 2.8 3.6 4.4 5.2 6 6.8 7.6 8.4 9.2 10 10.8 1.2 2 2.8 3.6 4.4 5.2 6 6.8 7.6 8.4 9.2 10 10.8 Noise Bin (ppmp-p) Noise Bin (ppmp-p)
Figure 6-13. 0.1Hz to 10Hz Noise Distribution Figure 6-14. 0.1Hz to 10Hz Noise Distribution (VREF = 2.5V, CNR = Open, IL = 0mA) (VREF = 5V, CNR = Open, IL = 0mA)
40 80 CNR = Open IL = 0mA CNR = 1uF IL = 1mA 32 CNR = 10uF 64 IL = 10mA 24 48 ation (%) ation (%) 16 32 Popul Popul 8 16 0 0 1.2 2 2.8 3.6 4.4 5.2 6 6.8 7.6 8.4 9.2 10 10.8 1.2 2 2.8 3.6 4.4 5.2 6 6.8 7.6 8.4 9.2 10 10.8 Noise Bin (ppmp-p) Noise Bin (ppmp-p)
Figure 6-15. 0.1Hz to 10Hz Noise Distribution Figure 6-16. 0.1Hz to 10Hz Noise Distribution (VREF = 2.5V, CL = 1μF, IL = 0mA) (VREF = 2.5V, CL = 1μF, CNR = Open)
750 1000 CL = 0.1F CL = 0.1F CL = 1F CL = 1F 600 CL = 10F 800 CL = 10F z) z) /H /H 450 600 ensity (nV ensity (nV 300 400 oise D oise D N N 150 200 0 0 10 100 1000 10000 100000 10 100 1000 10000 100000 Frequency (Hz) Frequency (Hz)
Figure 6-17. Noise Density vs Frequency Figure 6-18. Noise Density vs Frequency (V (V REF = 1.25V, IL = 0mA) REF = 2.5V, IL = 0mA)
10 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: REF35 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Device Comparison 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Electrical Characteristics YBH package 6.7 Typical Characteristics 7 Parameter Measurement Information 7.1 Solder Heat Shift 7.2 Temperature Coefficient 7.3 Long-Term Stability 7.4 Thermal Hysteresis 7.5 Noise Performance 7.5.1 Low-Frequency (1/f) Noise 7.5.2 Broadband Noise 7.6 Power Dissipation 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Supply Voltage 8.3.2 EN Pin 8.3.3 NR Pin 8.4 Device Functional Modes 8.4.1 Basic Connections 8.4.2 Start-Up 8.4.3 Output Transient Behavior 9 Application and Implementation 9.1 Application Information 9.2 Typical Applications 9.2.1 Negative Reference Voltage 9.2.2 Precision Power Supply and Reference 9.2.2.1 Design Requirements 9.2.2.2 Detailed Design Procedure 9.2.2.2.1 Selection of Reference 9.2.2.2.2 Input and Output Capacitors 9.2.2.2.3 Selection of ADC 9.2.2.3 Application Curves 9.3 Power Supply Recommendations 9.4 Layout 9.4.1 Layout Guidelines 9.4.2 Layout Examples 10 Device and Documentation Support 10.1 Documentation Support 10.1.1 Related Documentation 10.2 Receiving Notification of Documentation Updates 10.3 Support Resources 10.4 Trademarks 10.5 Electrostatic Discharge Caution 10.6 Glossary 11 Revision History 12 Mechanical, Packaging, and Orderable Information