Datasheet LM431SB (ON Semiconductor) - 2

FabricanteON Semiconductor
DescripciónAdjustable/2.5V, 1% Tolerance Shunt Regulator
Páginas / Página12 / 2 — LM431SA, LM431SB, LM431SC. BLOCK DIAGRAM. Figure 1. Block Diagram. …
Formato / tamaño de archivoPDF / 412 Kb
Idioma del documentoInglés

LM431SA, LM431SB, LM431SC. BLOCK DIAGRAM. Figure 1. Block Diagram. ABSOLUTE MAXIMUM RATINGS. Symbol. Parameter. Value. Unit

LM431SA, LM431SB, LM431SC BLOCK DIAGRAM Figure 1 Block Diagram ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit

Línea de modelo para esta hoja de datos

Versión de texto del documento

LM431SA, LM431SB, LM431SC BLOCK DIAGRAM Figure 1. Block Diagram ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise noted)
Symbol Parameter Value Unit
VKA Cathode Voltage 37 V IKA Cathode current Range (Continuous) −100 to +150 mA IREF Reference Input Current Range −0.05 to +10.00 mA RθJA Thermal Resistance Junction−Air (2, 3) ML Suffix Package (SOT−89) 220 °C/W MF Suffix Package (SOT−23FL) 350 M32, M3 Suffix Package (SOT−23) 400 PD Power Dissipation (4, 5) ML Suffix Package (SOT−89) 560 mW MF Suffix Package (SOT−23FL) 350 M32, M3 Suffix Package (SOT−23) 310 TJ Junction Temperature 150 °C All products except LM431SAIMFX −25 to +85 T °C OPR Operating Temperature Range LM431SAIMFX, SBIMFX, SCIMFX −40 to +85 TSTG Storage Temperature Range −65 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2. Thermal resistance test board Size: 1.6 mm x 76.2 mm x 114.3 mm (1S0P) JEDEC Standard: JESD51−3, JESD51−7. 3. Assume no ambient airflow. 4. TJMAX = 150°C; ratings apply to ambient temperature at 25°C. 5. Power dissipation calculation: PD = (TJ − TA) / RθJA.
RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min. Max. Unit
VKA Cathode Voltage VREF 36 V IKA Cathode Current 1 100 mA Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
www.onsemi.com 2