Datasheet STGAP3S6I (STMicroelectronics) - 7

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STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS Electrical characteristics Symbol Pin Parameter Test conditions Min. Typ. Max. Unit Logic inputs
V IN+, IN-, il Low-level logic threshold voltage 0.29·VDD 0.33·VDD 0.37·VDD V RST V IN+, IN-, ih High-level logic threshold voltage 0.62·VDD 0.66·VDD 0.70·VDD V RST IIN+h IN+ IN+ logic “1” input bias current IN+ = VDD 120 150 210 µA IIN+l IN+ IN+ logic “0” input bias current IN+ = GND - - 1 µA Rin_pd IN+ Input pull-down resistors IN+ = 5 V 23 33 42 kΩ I IN-, RST logic “0” input bias IN-l IN-, RST IN-, RST = GND 40 55 70 µA current I IN-, RST logic “1” input bias IN-h IN-, RST IN-, RST = VDD - - 1 µA current Rin_pu IN-, RST Input pull-up resistors IN+ = GND 70 90 125 kΩ trst RST Minimum pulse width to rest DIAG (3) 240 500 800 ns
Driver buffer section
TJ = 25 °C 4.8 6.0 6.9 STGAP3S6x A -40 °C ≤ TJ ≤ 125 °C 4.3 - 7.6 (2) IGON GOUT Source short-circuit current TJ = 25 °C 8 10 11.5 STGAP3SXx A -40 °C ≤ TJ ≤ 125 °C 7 - 13 (2) STGAP3S6x IGON = 100 mA 0.09 0.10 0.11 VGON GOUT GOUT output high-level voltage V STGAP3SXx IGON = 100 mA 0.05 0.07 0.08 STGAP3S6x IGON = 100 mA 0.86 0.96 1.10 RDON GOUT Source RDS_ON Ω STGAP3SXx IGON = 100 mA 0.50 0.65 0.80 TJ = 25 °C 5.2 6.0 6.8 STGAP3S6x A -40 °C ≤ TJ ≤ 125 °C 4.5 - 7.9 (2) IGOFF GOUT Sink short-circuit current TJ = 25 °C 8 10 11.5 STGAP3SXx A -40 °C ≤ TJ ≤ 125 °C 6.8 - 12.8 (2) STGAP3S6x IGOFF = 100 mA 0.05 0.07 0.09 VGOFF GOUT Sink output low-level voltage V STGAP3SXx IGOFF = 100 mA 0.03 0.05 0.07 STGAP3S6x IGOFF = 100 mA 0.55 0.70 0.85 RDOFF GOUT Sink RDS_ON Ω STGAP3SXx IGOFF = 100 mA 0.35 0.50 0.65
External Miller clamp driver
VCLAMPth CLAMPdrv CLAMP voltage threshold vs. VL 1.8 2.0 2.2 V TJ = 25 °C 215 280 355 I CLAMP source short-circuit CLAMPsource CLAMPdrv mA current -40 °C ≤ TJ ≤ 125 °C (2) 188 - 386 TJ = 25 °C 370 450 530 ICLAMPsink CLAMPdrv CLAMP sink short-circuit current mA -40 °C ≤ TJ ≤ 125 °C (2) 313 - 590 VCLAMPdrv_H CLAMPdrv CLAMP high-level output vs. VL No load, VHL ≥ 11.5 V 10.5 11.5 13.0 V
DS14758
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Rev 1 page 7/32
Document Outline STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS @NA Cover image @NA Device summary Features Applications Description 1 Block diagram 2 Pin description and connection diagram 3 Device ratings 3.1 Absolute maximum ratings 3.2 Thermal data 3.3 Recommended operating conditions 4 Electrical characteristics 5 Isolation 6 Functional description 6.1 Power supplies and UVLO 6.2 Power-up, power-down, and “safe state” 6.3 Control inputs 6.3.1 Anti cross conduction interlocking 6.4 Miller clamp function 6.4.1 Miller clamp driver 6.5 Desaturation protection 6.5.1 Adjustable soft turn-off function 6.6 Watchdog 6.7 Thermal shutdown protection 7 Typical application diagram 8 PCB layout 8.1 Layout guidelines and considerations 8.2 Layout example 9 Unused functions 10 Testing and characterization information 11 Package information 11.1 SO-16W package information 11.2 SO-16W suggested land pattern 12 Ordering information Revision history Contents List of tables List of figures