Datasheet CRCW0603 (Vishay) - 9
| Fabricante | Vishay |
| Descripción | Lead (Pb)-Bearing Thick Film Chip Resistors |
| Páginas / Página | 10 / 9 — D/CRCW. DIMENSIONS. DIMENSIONS AND MASS. MASS. TYPE / SIZE. (mm). (mg). … |
| Formato / tamaño de archivo | PDF / 135 Kb |
| Idioma del documento | Inglés |
D/CRCW. DIMENSIONS. DIMENSIONS AND MASS. MASS. TYPE / SIZE. (mm). (mg). D10/CRCW0402. D11/CRCW0603. D12/CRCW0805. D25/CRCW1206. CRCW1210
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D/CRCW
www.vishay.com Vishay
DIMENSIONS
L T2 W H T1
DIMENSIONS AND MASS L W H T1 T2 MASS TYPE / SIZE (mm) (mm) (mm) (mm) (mm) (mg) D10/CRCW0402
1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.10 0.2 ± 0.10 0.65
D11/CRCW0603
1.55 + 0.10 / - 0.05 0.85 ± 0.10 0.45 ± 0.05 0.3 ± 0.20 0.3 ± 0.20 2
D12/CRCW0805
2.0 + 0.20 / - 0.10 1.25 ± 0.15 0.5 ± 0.10 0.3 + 0.20 / - 0.10 0.3 ± 0.20 5.5
D25/CRCW1206
3.2 + 0.10 / - 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 10
CRCW1210
3.2 ± 0.20 2.5 ± 0.20 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 16
CRCW1218
3.2 + 0.10 / - 0.20 4.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 29.5
CRCW2010
5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.10 0.6 ± 0.20 0.6 ± 0.20 25.5
CRCW2512
6.3 ± 0.20 3.15 ± 0.15 0.6 ± 0.10 0.6 ± 0.20 0.6 ± 0.20 40.5
SOLDER PAD DIMENSIONS
G X Y Z
RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING REFLOW SOLDERING TYPE / SIZE G Y X Z G Y X Z (mm) (mm) (mm) (mm) (mm) (mm) (mm) (mm) D10/CRCW0402
- - - - 0.45 0.60 0.60 1.65
D11/CRCW0603
0.65 1.10 1.25 2.85 0.75 0.75 1.00 2.25
D12/CRCW0805
0.90 1.30 1.60 3.50 1.00 0.95 1.45 2.90
D25/CRCW1206
1.40 1.40 1.95 4.20 1.50 1.05 1.80 3.60
CRCW1210
1.80 1.45 2.95 4.70 1.70 1.10 2.80 3.90
CRCW1218
1.80 1.30 5.10 4.40 1.90 1.10 4.90 4.10
CRCW2010
3.40 1.65 2.85 6.70 3.50 1.45 2.80 6.40
CRCW2512
4.60 1.60 3.65 7.80 4.75 1.45 3.50 7.65
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. Still, the given solder pad dimensions will be found adequate for most general applications Revision: 09-Jul-2024
9
Document Number: 20008 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay
DIMENSIONS
L T2 W H T1
DIMENSIONS AND MASS L W H T1 T2 MASS TYPE / SIZE (mm) (mm) (mm) (mm) (mm) (mg) D10/CRCW0402
1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.10 0.2 ± 0.10 0.65
D11/CRCW0603
1.55 + 0.10 / - 0.05 0.85 ± 0.10 0.45 ± 0.05 0.3 ± 0.20 0.3 ± 0.20 2
D12/CRCW0805
2.0 + 0.20 / - 0.10 1.25 ± 0.15 0.5 ± 0.10 0.3 + 0.20 / - 0.10 0.3 ± 0.20 5.5
D25/CRCW1206
3.2 + 0.10 / - 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 10
CRCW1210
3.2 ± 0.20 2.5 ± 0.20 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 16
CRCW1218
3.2 + 0.10 / - 0.20 4.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 29.5
CRCW2010
5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.10 0.6 ± 0.20 0.6 ± 0.20 25.5
CRCW2512
6.3 ± 0.20 3.15 ± 0.15 0.6 ± 0.10 0.6 ± 0.20 0.6 ± 0.20 40.5
SOLDER PAD DIMENSIONS
G X Y Z
RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING REFLOW SOLDERING TYPE / SIZE G Y X Z G Y X Z (mm) (mm) (mm) (mm) (mm) (mm) (mm) (mm) D10/CRCW0402
- - - - 0.45 0.60 0.60 1.65
D11/CRCW0603
0.65 1.10 1.25 2.85 0.75 0.75 1.00 2.25
D12/CRCW0805
0.90 1.30 1.60 3.50 1.00 0.95 1.45 2.90
D25/CRCW1206
1.40 1.40 1.95 4.20 1.50 1.05 1.80 3.60
CRCW1210
1.80 1.45 2.95 4.70 1.70 1.10 2.80 3.90
CRCW1218
1.80 1.30 5.10 4.40 1.90 1.10 4.90 4.10
CRCW2010
3.40 1.65 2.85 6.70 3.50 1.45 2.80 6.40
CRCW2512
4.60 1.60 3.65 7.80 4.75 1.45 3.50 7.65
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. Still, the given solder pad dimensions will be found adequate for most general applications Revision: 09-Jul-2024
9
Document Number: 20008 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000