Datasheet MAX6006B (Analog Devices) - 2
| Fabricante | Analog Devices |
| Descripción | 1µA SOT23 Precision Shunt Voltage Reference |
| Páginas / Página | 8 / 2 — Absolute Maximum Ratings. Package Information. 3 SOT23. PACKAGE CODE. … |
| Formato / tamaño de archivo | PDF / 1.2 Mb |
| Idioma del documento | Inglés |
Absolute Maximum Ratings. Package Information. 3 SOT23. PACKAGE CODE. U3+1. 21-0051. 90-0179. Thermal Resistance, Multilayer Board:
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MAX6006–MAX6009 1µA SOT23 Precision Shunt Voltage Reference
Absolute Maximum Ratings
Operating Current (OUT to GND) ...20mA Operating Temperature Range ... -40°C to +85°C Forward Current (GND to OUT) ...20mA Storage Temperature Range .. -65°C to +150°C Continuous Power Dissipation (TA = +70°C) Lead Temperature (soldering, 10s) ...+300°C 3-Pin SOT23 (derate 3.65mW/°C above +70°C) ...291.73mW Soldering Temperature (reflow) ...+260°C 8-Pin SO (derate 7.4mW/°C above +70°C) ..588.2mW Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information 3 SOT23 PACKAGE CODE U3+1
Outline Number
21-0051
Land Pattern Number
90-0179 Thermal Resistance, Multilayer Board:
Junction to Ambient (θJA) 274.23°C/W Junction to Case (θJC) 86.19°C/W
8 SO PACKAGE CODE S8+2
Outline Number
21-0041
Land Pattern Number
90-0096 Thermal Resistance, Multilayer Board:
Junction to Ambient (θJA) 136°C/W Junction to Case (θJC) 38°/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
Electrical Characteristics—MAX6006
(TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
T MAX6006A (0.2%) 1.2475 1.2500 1.2525 Reverse Breakdown Voltage V A = +25°C, R V IR = 1.2µA MAX6006B (0.5%) 1.2438 1.2500 1.2563 Minimum Operating Current IRMIN VR change < 0.2% from VR at IR = 1.2µA 0.5 1.0 µA Reverse Breakdown Change IR = 1.2µA to 200µA 1.0 mV with Current IR = 200µA to 2mA 2.0 Reverse Dynamic Impedance IR = 1.2µA to 2mA (Note 2) 1.5 W Low-Frequency Noise IR = 1.2µA, f = 0.1Hz to 10Hz 30 µVP-P Temperature Coefficient MAX6006A 30 TC I ppm/°C (Note 3) R = 1.2µA MAX6006B 75 Long-Term Drift 1000h at TA = +25°C 150 ppm Thermal Hysteresis (Note 4) 200 ppm www.maximintegrated.com Maxim Integrated │ 2
Absolute Maximum Ratings
Operating Current (OUT to GND) ...20mA Operating Temperature Range ... -40°C to +85°C Forward Current (GND to OUT) ...20mA Storage Temperature Range .. -65°C to +150°C Continuous Power Dissipation (TA = +70°C) Lead Temperature (soldering, 10s) ...+300°C 3-Pin SOT23 (derate 3.65mW/°C above +70°C) ...291.73mW Soldering Temperature (reflow) ...+260°C 8-Pin SO (derate 7.4mW/°C above +70°C) ..588.2mW Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information 3 SOT23 PACKAGE CODE U3+1
Outline Number
21-0051
Land Pattern Number
90-0179 Thermal Resistance, Multilayer Board:
Junction to Ambient (θJA) 274.23°C/W Junction to Case (θJC) 86.19°C/W
8 SO PACKAGE CODE S8+2
Outline Number
21-0041
Land Pattern Number
90-0096 Thermal Resistance, Multilayer Board:
Junction to Ambient (θJA) 136°C/W Junction to Case (θJC) 38°/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
.
Electrical Characteristics—MAX6006
(TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
T MAX6006A (0.2%) 1.2475 1.2500 1.2525 Reverse Breakdown Voltage V A = +25°C, R V IR = 1.2µA MAX6006B (0.5%) 1.2438 1.2500 1.2563 Minimum Operating Current IRMIN VR change < 0.2% from VR at IR = 1.2µA 0.5 1.0 µA Reverse Breakdown Change IR = 1.2µA to 200µA 1.0 mV with Current IR = 200µA to 2mA 2.0 Reverse Dynamic Impedance IR = 1.2µA to 2mA (Note 2) 1.5 W Low-Frequency Noise IR = 1.2µA, f = 0.1Hz to 10Hz 30 µVP-P Temperature Coefficient MAX6006A 30 TC I ppm/°C (Note 3) R = 1.2µA MAX6006B 75 Long-Term Drift 1000h at TA = +25°C 150 ppm Thermal Hysteresis (Note 4) 200 ppm www.maximintegrated.com Maxim Integrated │ 2