Datasheet TLV7031, TLV7032, TLV7034, TLV7041, TLV7042, TLV7044 (Texas Instruments) - 6

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TLV7031, TL V7032, TLV7041, TLV7042, TL V7034, TL V7044
SLVSE13I – SEPTEMBER 2017 – REVISED JUNE 2024
www.ti.com 5 Specifications 5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage VS = VCC - VEE –0.3 7 V Input pins (IN+, IN-)(2) VEE – 0.3 7 V Current into Input pins (IN+, IN-) ±10 mA Output (OUT) (TLV703x)(3) VEE – 0.3 VCC + 0.3 V Output (OUT) (TLV704x) VEE – 0.3 7 V Output short-circuit duration(4) 10 s Junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input terminals are diode-clamped to VEE. Input signals that can swing 0.3V below VEE must be current-limited to 10mA or less (3) Output maximum is (VCC + 0.3V) or 7V, whichever is less. (4) Short-circuit to ground, one comparator per package.
5.2 ESD Ratings VALUE UNIT
Electrostatic Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) V discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.
5.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage VS = VCC – VEE 1.6 6.5 V Input voltage range VEE – 0.1 VCC + 0.1 V Ambient temperature, TA –40 125 °C
5.4 Thermal Information (Single) TLV7031/TLV7041 THERMAL METRIC
(1)
DPW (X2SON) DBV (SOT-23) DCK (SC70) UNIT 5 PINS 5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 533.2 297.2 278.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 302.7 224.7 186.6 °C/W RθJB Junction-to-board thermal resistance 408.3 200.1 113.2 °C/W ΨJT Junction-to-top characterization parameter 71.5 141.2 82.3 °C/W ΨJB Junction-to-board characterization parameter 405.9 198.9 112.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 188.3 N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: TLV7031 TLV7032 TLV7041 TLV7042 TLV7034 TLV7044 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Pin Configuration and Functions Pin Functions Pin Functions: TLV7032/42 Pin Functions: TLV7034/44 5 Specifications 5.1 Absolute Maximum Ratings 5.2 ESD Ratings 5.3 Recommended Operating Conditions 5.4 Thermal Information (Single) 5.5 Thermal Information (Dual) 5.6 Thermal Information (Quad) 5.7 Electrical Characteristics (Single) 5.8 Switching Characteristics (Single) 5.9 Electrical Characteristics (Dual) 5.10 Switching Characteristics (Dual) 5.11 Electrical Characteristics (Quad) 5.12 Switching Characteristics (Quad) 5.13 Timing Diagrams 5.14 Typical Characteristics 6 Detailed Description 6.1 Overview 6.2 Functional Block Diagram 6.3 Feature Description 6.4 Device Functional Modes 6.4.1 Inputs 6.4.2 Internal Hysteresis 6.4.3 Output 7 Application and Implementation 7.1 Application Information 7.1.1 Inverting Comparator With Hysteresis for TLV703x 7.1.2 Noninverting Comparator With Hysteresis for TLV703x 7.2 Typical Applications 7.2.1 Window Comparator 7.2.1.1 Design Requirements 7.2.1.2 Detailed Design Procedure 7.2.1.3 Application Curve 7.2.2 IR Receiver Analog Front End 7.2.2.1 Design Requirements 7.2.2.2 Detailed Design Procedure 7.2.2.3 Application Curve 7.2.3 Square-Wave Oscillator 7.2.3.1 Design Requirements 7.2.3.2 Detailed Design Procedure 7.2.3.3 Application Curve 7.2.4 Quadrature Rotary Encoder 7.2.4.1 Design Requirements 7.2.4.2 Detailed Design Procedure 7.2.4.3 Application Curve 7.3 Power Supply Recommendations 7.4 Layout 7.4.1 Layout Guidelines 7.4.2 Layout Example 8 Device and Documentation Support 8.1 Device Support 8.1.1 Development Support 8.1.1.1 Evaluation Module 8.2 Documentation Support 8.2.1 Related Documentation 8.3 Receiving Notification of Documentation Updates 8.4 Support Resources 8.5 Trademarks 8.6 Electrostatic Discharge Caution 8.7 Glossary 9 Revision History 10 Mechanical, Packaging, and Orderable Information