Datasheet BC637, BC639, BC639-16 (ON Semiconductor) - 5

FabricanteON Semiconductor
DescripciónHigh Current Transistors
Páginas / Página5 / 5 — BC637, BC639, BC639−16. PACKAGE DIMENSIONS. TO−92 (TO−226). SEATING. …
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BC637, BC639, BC639−16. PACKAGE DIMENSIONS. TO−92 (TO−226). SEATING. INCHES. MILLIMETERS. PLANE. DIM. MIN. MAX. X X. SECTION X−X

BC637, BC639, BC639−16 PACKAGE DIMENSIONS TO−92 (TO−226) SEATING INCHES MILLIMETERS PLANE DIM MIN MAX X X SECTION X−X

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BC637, BC639, BC639−16 PACKAGE DIMENSIONS TO−92 (TO−226)
CASE 29−11 ISSUE AM NOTES:
A B
STRAIGHT LEAD 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. BULK PACK 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R
R
IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND
P
BEYOND DIMENSION K MINIMUM.
L SEATING INCHES MILLIMETERS PLANE K DIM MIN MAX MIN MAX A
0.175 0.205 4.45 5.20
B
0.170 0.210 4.32 5.33
C
0.125 0.165 3.18 4.19
D
0.016 0.021 0.407 0.533
D X X G
0.045 0.055 1.15 1.39
G H
0.095 0.105 2.42 2.66
J
0.015 0.020 0.39 0.50
H J K
0.500 --- 12.70 ---
V L
0.250 --- 6.35 ---
C N
0.080 0.105 2.04 2.66
SECTION X−X P
--- 0.100 --- 2.54
R
0.115 --- 2.93 ---
1 N V
0.135 --- 3.43 ---
N
NOTES:
A B
BENT LEAD 1. DIMENSIONING AND TOLERANCING PER
R
ASME Y14.5M, 1994. TAPE & REEL 2. CONTROLLING DIMENSION: MILLIMETERS. AMMO PACK 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P
P
AND BEYOND DIMENSION K MINIMUM.
T SEATING K MILLIMETERS PLANE DIM MIN MAX A
4.45 5.20
B
4.32 5.33
C
3.18 4.19
D X X D
0.40 0.54
G G
2.40 2.80
J
0.39 0.50
J K
12.70 ---
V N
2.04 2.66
C P
1.50 4.00
R
2.93 ---
SECTION X−X V
3.43 ---
1 N
STYLE 14: PIN 1. EMITTER 2. COLLECTOR 3. BASE
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