Datasheet TLR377GYZ (Rohm) - 3

TLR377GYZ Absolute Maximum Ratings (Ta = 25 °C)
Parameter Symbol Rating Unit Supply Voltage (VDD - VSS) VS 7.0 V Input Pin Voltage (+IN, -IN, SDNB) VI (VSS - 0.3) to (VSS + 7.0) V Input Pin Current (+IN, -IN, SDNB) II ±10 mA Maximum Junction Temperature Tjmax 150 °C Storage Temperature Range Tstg -55 to +150 °C
Caution 1:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operate over the absolute maximum ratings.
Caution 2:
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ) Parameter Symbol Unit 2s2p(Note 3) YCSP30L1 Junction to Ambient θJA 489.0 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 4.0 °C/W (Note 1) Based on JESD51-2A (Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-9. Layer Number of Material Measurement Board Board Size 4 Layers FR-4 114.5 mm x 101.5 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 99.5 mm x 99.5 mm 35 μm 99.5 mm x 99.5 mm 70 μm
Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit Single Supply 1.8 5.0 5.5 Supply Voltage (VDD - VSS) VS V Dual Supply ±0.90 ±2.50 ±2.75 Operating Temperature Topr -20 +25 +85 °C

www.rohm.com
TSZ02201-0GLG2G800110-1-2
© 2023 ROHM Co., Ltd. All rights reserved. 3

/20 TSZ22111 • 15 • 001
27.Jun.2023 Rev.001
Document Outline General Description Features Applications Key Specifications Package Typical Application Circuit Pin Configuration Pin Description Block Diagram Description of Blocks Absolute Maximum Ratings Thermal Resistance Recommended Operating Conditions Electrical Characteristics Typical Performance Curves Figure 1. Supply Current vs Supply Voltage Figure 2. Supply Current vs Ambient Temperature Figure 3. Output Voltage High vs Supply Voltage Figure 4. Output Voltage High vs Ambient Temperature Figure 5. Output Voltage Low vs Supply Voltage Figure 6. Output Voltage Low vs Ambient Temperature Figure 7. Output Source Current vs Output Voltage Figure 8. Output Sink Current vs Output Voltage Figure 9. Input Offset Voltage vs Supply Voltage Figure 10. Input Offset Voltage vs Ambient Temperature Figure 11. Input Offset Voltage vs Input Common-mode Voltage Figure 12. Large Signal Voltage Gain vs Supply Voltage Figure 13. Large Signal Voltage Gain vs Ambient Temperature Figure 14. Common-mode Rejection Ratio vs Supply Voltage Figure 15. Common-mode Rejection Ratio vs Ambient Temperature Figure 16. Power Supply Rejection Ratio vs Ambient Temperature Figure 17. Input Bias Current vs Ambient Temperature Figure 18. Input-referred Noise Voltage Density vs Frequency Figure 19. Slew Rate vs Supply Voltage Figure 20. Slew Rate vs Ambient Temperature Figure 21. Gain Bandwidth Product vs Ambient Temperature Figure 22. Phase Margin vs Load Capacitance Figure 23. Voltage Gain, Phase vs Frequency Figure 24. Voltage Gain vs Frequency Figure 25. Turn On Time vs Ambient Temperature Figure 26. Turn Off Time vs Ambient Temperature Figure 27. Shutdown Current vs Ambient Temperature Figure 28. Output Voltage vs SDNB Voltage Application Information Application Examples I/O Equivalence Circuits Operational Notes 1. Reverse Connection of Power Supply 2. Power Supply Lines 3. Ground Voltage 4. Ground Wiring Pattern 5. Recommended Operating Conditions 6. Inrush Current 7. Testing on Application Boards 8. Inter-pin Short and Mounting Errors 9. Unused Input Pins 10. Regarding the Input Pin of the IC 11. Ceramic Capacitor 12. Disturbance Light Ordering Information Marking Diagram Physical Dimension and Packing Information Revision History