Datasheet ADP1621 (Analog Devices) - 6

ADP1621 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2.
Absolute maximum ratings apply individually only, not in
Parameter Rating
combination. Unless otherwise specified, all other voltages are referenced to GND. IN to GND −0.3 V to VSHUNT FB, COMP, SDSN, FREQ, GATE to GND −0.3 V to (VIN + 0.3 V)
THERMAL RESISTANCE
CS to GND −5 V to +33 V θJA is specified for the worst-case conditions, that is, a device PIN to PGND −0.3 V to VSHUNT soldered in a circuit board for surface-mount packages. Supply Current into IN 25 mA Supply Current into PIN 35 mA
Table 3. Thermal Resistance
Storage Temperature Range −55°C to +150°C
Package Type θJA Unit
Junction Operating Temperature Range1 −55°C to +150°C 10-Lead MSOP on a 2-Layer Printed Circuit Board (PCB) 200 °C/W Junction Storage Temperature Range −55°C to +150°C 10-Lead MSOP on a 4-Layer PCB 172 °C/W Lead Temperature (Soldering, 10 sec) 300°C Package Power Dissipation1 (T Junction-to-ambient thermal resistance of the package is based J,MAX − TA)/θJA on modeling and calculation using 2-layer and 4-layer boards, and 1 In applications where high power dissipation and poor package thermal natural convection. The junction-to-ambient thermal resistance is resistance are present, the maximum ambient temperature may need to be derated. Maximum ambient temperature (TA,MAX) is dependent on the maximum application- and board-layout dependent. In applications where operating junction temperature (TJ,MAX = 150oC), the maximum power dissipation high maximum power dissipation exists, attention to thermal of the device in the application (PD,MAX), and the junction-to-ambient thermal resistance of the package in the application (θ dissipation issues in board design is required. JA), is given by the following equation: TA,MAX = TJ,MAX – (θJA x PD,MAX).
ESD CAUTION
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. D | Page 6 of 32 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS REVISION HISTORY SIMPLIFIED BLOCK DIAGRAM SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION CONTROL LOOP CURRENT-SENSE CONFIGURATIONS CURRENT LIMIT UNDERVOLTAGE LOCKOUT SHUTDOWN SOFT START INTERNAL SHUNT REGULATORS SETTING THE OSCILLATOR FREQUENCY AND SYNCHRONIZATION FREQUENCY APPLICATION INFORMATION: BOOST CONVERTER ADIsimPower DESIGN TOOL DUTY CYCLE SETTING THE OUTPUT VOLTAGE INDUCTOR CURRENT RIPPLE INDUCTOR SELECTION INPUT CAPACITOR SELECTION OUTPUT CAPACITOR SELECTION DIODE SELECTION MOSFET SELECTION LOOP COMPENSATION SLOPE COMPENSATION CURRENT LIMIT LIGHT LOAD OPERATION Discontinuous Conduction Mode Pulse-Skipping Modulation RECOMMENDED COMPONENT MANUFACTURERS LAYOUT CONSIDERATIONS EFFICIENCY CONSIDERATIONS EXAMPLES OF APPLICATION CIRCUITS STANDARD BOOST CONVERTER—DESIGN EXAMPLE BOOTSTRAPPED BOOST CONVERTER Low Input and High Output Boost Converter High Input Voltage Boost Converter Circuit SEPIC CONVERTER CIRCUIT LOW VOLTAGE POWER-INPUT CIRCUIT LED DRIVER APPLICATION CIRCUITS RELATED DEVICES OUTLINE DIMENSIONS ORDERING GUIDE