Datasheet MBR350, MBR360 (ON Semiconductor) - 3

MBR350, MBR360
5.0 300 TTS) A 200 T 4.0 T J = 25C J = 150C TION (W A 3.0 SQUARE ANCE (pF) 100 WAVE ACIT 2.0 70 dc C, CAP 50 1.0 VERAGE POWER DISSIP A 40 V) , P F (A 0 30 0 1.0 2.0 3.0 4.0 5.0 0 10 20 30 40 50 I V F (AV), AVERAGE FORWARD CURRENT (AMPS) R, REVERSE VOLTAGE (VOLTS)
Figure 4. Power Dissipation Figure 5. Typical Capacitance NOTE 4 — MOUNTING DATA
Data shown for thermal resistance, junction−to−ambient (RqJA) for the mountings shown is to be used as typical guideline values for preliminary engineering, or in case the tie point temperature cannot be measured.
TYPICAL VALUES FOR R
q
JA IN STILL AIR Lead Length, L (in) Mounting Method 1/8 1/4 1/2 3/4 R
q
JA
1 50 51 53 55 C/W 2 58 59 61 63 C/W 3 28 C/W
Mounting Method 1 Mounting Method 2 Mounting Method 3
P.C. Board where available Vector Push−In Terminals T−28 P.C. Board with 2−1/2 in X 2−1/2 in copper surface is small. copper surface. ÉÉ
L L L L L = 1/2’’
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Board Ground Plane
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