Datasheet MAC223FP, MAC223AFP (Motorola) - 4

FabricanteMotorola
DescripciónSilicon Bidirectional Triode Thyristors
Páginas / Página4 / 4 — PACKAGE DIMENSIONS. –T– SEATING. PLANE. –B–. INCHES. MILLIMETERS. DIM. …
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Idioma del documentoInglés

PACKAGE DIMENSIONS. –T– SEATING. PLANE. –B–. INCHES. MILLIMETERS. DIM. MIN. MAX. 1 2 3. –Y–. D 3 PL. CASE 221C-02

PACKAGE DIMENSIONS –T– SEATING PLANE –B– INCHES MILLIMETERS DIM MIN MAX 1 2 3 –Y– D 3 PL CASE 221C-02

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PACKAGE DIMENSIONS
NOTES:
–T– SEATING PLANE
1. DIMENSIONING AND TOLERANCING PER ANSI
–B–
Y14.5M, 1982.
F C
2. CONTROLLING DIMENSION: INCH.
P S
3. LEAD DIMENSIONS UNCONTROLLED WITHIN
N
DIMENSION Z.
INCHES MILLIMETERS E DIM MIN MAX MIN MAX A
0.680 0.700 17.28 17.78
A B
0.388 0.408 9.86 10.36
Q H C
0.175 0.195 4.45 4.95 STYLE 3:
1 2 3 D
0.025 0.040 0.64 1.01 PIN 1. MT 1
E
0.340 0.355 8.64 9.01 2. MT 2
–Y– F
0.140 0.150 3.56 3.81 3. GATE
G
0.100 BSC 2.54 BSC
K H
0.110 0.155 2.80 3.93
J
0.018 0.028 0.46 0.71
Z K
0.500 0.550 12.70 13.97
L
0.045 0.070 1.15 1.77
L J N
0.049 ––– 1.25 –––
P
0.270 0.290 6.86 7.36
G R Q
0.480 0.500 12.20 12.70
R
0.090 0.120 2.29 3.04
D 3 PL S
0.105 0.115 2.67 2.92 0.25 (0.010) M B M Y
Z
0.070 0.090 1.78 2.28
CASE 221C-02
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MAC223FP/D
*MAC223FP/D*