Datasheet MB2S, MB4S, MB6S (Vishay)

FabricanteVishay
DescripciónMiniature Glass Passivated Fast Recovery Surface-Mount Bridge Rectifier
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MB2S, MB4S, MB6S. Miniature Glass Passivated Fast Recovery. Surface-Mount Bridge Rectifier. FEATURES. TYPICAL APPLICATIONS

Datasheet MB2S, MB4S, MB6S Vishay

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MB2S, MB4S, MB6S
www.vishay.com Vishay General Semiconductor
Miniature Glass Passivated Fast Recovery Surface-Mount Bridge Rectifier FEATURES
• UL recognition, file number E54214 ~ • Saves space on printed circuit boards • Ideal for automated placement ~ • High surge current capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 ~
TYPICAL APPLICATIONS
General purpose use in AC/DC bridge full wave rectification ~ for power supply, lighting ballaster, battery charger, home
MBS (TO-269AA)
appliances, office equipment, and telecommunication applications.
LINKS TO ADDITIONAL RESOURCES MECHANICAL DATA D 3 3 Case:
MBS (TO-269AA)
D
3D Models Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS-compliant, commercial grade
Terminals:
matte tin plated leads, solderable per
PRIMARY CHARACTERISTICS
J-STD-002 and JESD22-B102 IF(AV) 0.5 A E3 suffix meets JESD 201 class 1A whisker test VRRM 200 V, 400 V, 600 V
Polarity:
as marked on body IFSM 35 A  IR 5 μA  VF at IF = 0.4 A 1.0 V TJ max. 150 °C Package MBS (TO-269AA) Circuit configuration Quad
MAXIMUM RATINGS
(TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL MB2S MB4S MB6S UNIT
Device marking code 2 4 6 Maximum repetitive peak reverse voltage VRRM 200 400 600 V Maximum RMS voltage VRMS 140 280 420 V Maximum DC blocking voltage VDC 200 400 600 V Maximum average forward output on glass-epoxy PCB (1) 0.5 I A rectified current (fig. 1) F(AV) on aluminum substrate (2) 0.8 Peak forward surge current 8.3 ms single half sine-wave I superimposed on rated load FSM 35 A Rating for fusing (t < 8.3 ms) I2t 5.0 A2s Operating junction and storage temperature range TJ, TSTG -55 to +150 °C
Notes
(1) On glass epoxy PCB mounted on 0.05" x 0.05" (1.3 mm x 1.3 mm) pads (2) On aluminum substrate PCB with an area of 0.8" x 0.8" (20 mm x 20 mm) mounted on 0.05" x 0.05" (1.3 mm x 1.3 mm) solder pad Revision: 04-Aug-2020
1
Document Number: 88661 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000