Datasheet MD1S, MD2S, MD3S, MD4S, MD5S, MD6S, MD7S (Rectron Semiconductor) - 5

REEL TAPING SPECIFICATIONS FOR SURFACE MOUNT DEVICES - MINI DIP P0 P1 d P E F B W O 4 C O 8 T A D D1 D2 W1 Fig.: Configuration of MINI DIP REEL TAPING ITEM SYMBOL SPECIFICATIONS (mm) SPECIFICATIONS (inch) Carrier width A 5.0 0.1 0.197 0.004 Carrier length B 3.2 0.1 0.126 0.004 Carrier depth C 2.9 0.1 0.114 0.004 Sprocket hole d 1.5 0.1/-0 0.059 0.004 Reel outside diameter D 178 2.0 7.008 0.079 Reel inner diameter D1 8.0 0.2 0.315 0.008 Feed hole diameter D2 13 0.5 0.512 0.020 Sprocket hole position E 1.75 0.1 0.069 0.004 Punch hole position F 5.5 0.5 0.217 0.020 Punch hole pitch P 8.0 0.1 0.315 0.004 Sprocket hole pitch P0 4.0 0.1 0.157 0.004 Embossment center P1 2.0 0.05 0.079 0.002 Overall tape thickness T 2.65 0.1 0.104 0.004 Tape width W 12.0+0.3/-0.1 0.472+0.012/-0.004 Reel width W1 16.8 2.0 0.661 0.079 Notes : 1.Devices are packed in accordance with EIA stand RS-481-D and specifications listed above. 2.Available on 7 inch ( 500 c.t. ) or 13 inch ( 3000 c.t. ) diameter reels. D7 Visit http:// www.rectron.com for complete datasheets