Datasheet UDA1330ATS (NXP) - 7

FabricanteNXP
DescripciónLow-cost stereo filter DAC
Páginas / Página23 / 7 — boo. 20. NXP. Semiconductors. k,. full. pagewidth. 01. Low-cost. stereo. …
Formato / tamaño de archivoPDF / 169 Kb
Idioma del documentoInglés

boo. 20. NXP. Semiconductors. k,. full. pagewidth. 01. Low-cost. stereo. filter. DAC. Fe. b. 0. 2. WS. LEFT. RIGHT. 1. 2. 3. >. =. 8. 1. 2. 3. >. =. 8. BCK. DATA. MSB. B2. MSB. B2. MSB

boo 20 NXP Semiconductors k, full pagewidth 01 Low-cost stereo filter DAC Fe b 0 2 WS LEFT RIGHT 1 2 3 > = 8 1 2 3 > = 8 BCK DATA MSB B2 MSB B2 MSB

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boo 20 NXP Semiconductors k, full pagewidth 01 Low-cost stereo filter DAC Fe b 0 2 WS LEFT RIGHT 1 2 3 > = 8 1 2 3 > = 8 BCK DATA MSB B2 MSB B2 MSB I2S-BUS FORMAT WS LEFT RIGHT 1 2 3 > = 8 1 2 3 > = 8 BCK DATA MSB B2 LSB MSB B2 LSB MSB B2 MSB-JUSTIFIED FORMAT WS LEFT RIGHT 16 15 2 1 16 15 2 1 BCK 7 DATA MSB B2 B15 LSB MSB B2 B15 LSB LSB-JUSTIFIED FORMAT 16 BITS WS LEFT RIGHT 18 17 16 15 2 1 18 17 16 15 2 1 BCK DATA MSB B2 B3 B4 B17 LSB MSB B2 B3 B4 B17 LSB LSB-JUSTIFIED FORMAT 18 BITS WS LEFT RIGHT 20 19 18 17 16 15 2 1 20 19 18 17 16 15 2 1 BCK U DATA MSB B2 B3 B4 B5 B6 B19 LSB MSB B2 B3 B4 B5 B6 B19 LSB DA1330A Pr LSB-JUSTIFIED FORMAT 20 BITS MBL140 odu c t s pec ifica TS Fig i .3 D 3 igital interface input fo u rmat da t ta format. t tio n Document Outline Features General Multiple format input interface DAC digital sound processing Advanced audio configuration Applications General description Ordering information Quick reference data Block diagram Pinning Functional description System clock Application modes Multiple format input interface Interpolation filter (DAC) Noise shaper Filter stream DAC Pin compatibility L3 interface Address mode Data transfer mode Registers Programming the features Limiting values Handling Thermal characteristics Quality specification DC characteristics AC characteristics Timing Application information Package outline Soldering Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods Data sheet status Disclaimers