Datasheet FDC5614P (Fairchild) - 4
| Fabricante | Fairchild |
| Descripción | P-Channel, POWERTRENCH), Logic 60 V |
| Páginas / Página | 7 / 4 — FDC5614P. TYPICAL CHARACTERISTICS. oltage (V). −Source V. Capacitance … |
| Formato / tamaño de archivo | PDF / 336 Kb |
| Idioma del documento | Inglés |
FDC5614P. TYPICAL CHARACTERISTICS. oltage (V). −Source V. Capacitance (pF). , Gate. V GS. Qg, Gate Charge (nC)
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FDC5614P TYPICAL CHARACTERISTICS
(continued) 10 I 1200 D = −3.0 A VDS = −10 V f = 1 Mhz VGS = 0 V 8 1000 CISS
oltage (V)
−20 V 800 6 −30 V 600 4
−Source V Capacitance (pF)
400
, Gate
COSS 2
V GS
200 CRSS 0 0 0 4 8 12 16 0 10 20 30 40 50 60
Qg, Gate Charge (nC) VDS, Drain to Source Voltage (V) Figure 7. Gate Charge Characteristics Figure 8. Capacitance Characteristics
30 1000 This Area is Limited 10 by RDS(on) Single Pulse RJA = 156°C/W 100 TA = 25°C 100 s 1 10 1 ms
ransient Power (W)
10 ms
, Drain Current (A)
Single Pulse
I D
0.1 TJ = Max Rated 100 ms
, Peak T
1 RJA = 156°C/W TA = 25°C 1 s
P (pk)
0.01 DC 0.1 0.01 0.1 1 10 100 300 10−4 10−3 10−2 10−1 1 10 100 1000
VDS, Drain to Source Voltage (V) t, Pulse Width (s) Figure 9. Maximum Safe Opening Area Figure 11. Single Pulse Maximum Power Dissipation
2 Duty Cycle−Descending Order 1 D = 0.5 0.2 0.1 0.1 0.05 PDM 0.02 t1 0.01 t2 0.01 RJA(t)= r(t) x RJA R Single Pulse JA = 156 °C/W
, Normalized Thermal Impedance
Peak TJ = PDM x ZJA(t) + TA Duty Cycle, D = t1 / t2
Z qJA
0.00110−4 10−3 10−2 10−1 1 10 100 1000
t, Regular Pulse Duration (s) Figure 10. Transient Thermal Response Curve
NOTE: Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design.
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FDC5614P TYPICAL CHARACTERISTICS
(continued) 10 I 1200 D = −3.0 A VDS = −10 V f = 1 Mhz VGS = 0 V 8 1000 CISS
oltage (V)
−20 V 800 6 −30 V 600 4
−Source V Capacitance (pF)
400
, Gate
COSS 2
V GS
200 CRSS 0 0 0 4 8 12 16 0 10 20 30 40 50 60
Qg, Gate Charge (nC) VDS, Drain to Source Voltage (V) Figure 7. Gate Charge Characteristics Figure 8. Capacitance Characteristics
30 1000 This Area is Limited 10 by RDS(on) Single Pulse RJA = 156°C/W 100 TA = 25°C 100 s 1 10 1 ms
ransient Power (W)
10 ms
, Drain Current (A)
Single Pulse
I D
0.1 TJ = Max Rated 100 ms
, Peak T
1 RJA = 156°C/W TA = 25°C 1 s
P (pk)
0.01 DC 0.1 0.01 0.1 1 10 100 300 10−4 10−3 10−2 10−1 1 10 100 1000
VDS, Drain to Source Voltage (V) t, Pulse Width (s) Figure 9. Maximum Safe Opening Area Figure 11. Single Pulse Maximum Power Dissipation
2 Duty Cycle−Descending Order 1 D = 0.5 0.2 0.1 0.1 0.05 PDM 0.02 t1 0.01 t2 0.01 RJA(t)= r(t) x RJA R Single Pulse JA = 156 °C/W
, Normalized Thermal Impedance
Peak TJ = PDM x ZJA(t) + TA Duty Cycle, D = t1 / t2
Z qJA
0.00110−4 10−3 10−2 10−1 1 10 100 1000
t, Regular Pulse Duration (s) Figure 10. Transient Thermal Response Curve
NOTE: Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design.
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